Telit Wireless Solutions BlueMod+S50, Руководство пользователя по оборудованию

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S50 Hardware User Guide
1VV0301505 Rev. 3
Page 38 of 60 2021-05-05
Not Subject to NDA
7.3. Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and must be adapted to your process
and other re-flow parameters for example the used solder paste. The paste
manufacturer provides a re-flow profile recommendation for his product.
Figure 22: Soldering Temperature-Time Profile (For Reflow Soldering)
Preheat Main Heat Peak
Tsmax tLmax tpmax
Temperature Time Temperature Time Temperature Time
[°C] [sec] [°C] [sec] [°C] [sec]
150
100
217 90 260
10
230 50
Average ramp-up rate
[°C / sec] 3
Average ramp-down rate [°C / sec] 6
Max. Time 25°C to Peak
Temperature
[min.] 8
Opposite side reflow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to one re-flows to a
maximum temperature of 260°C. The reflow soldering profile may only be applied if the
S50 resides on the PCB side looking up. Heat above the solder eutectic point
while the S50 is mounted facing down may damage the module permanently.