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Telink FR1 PCB Design Guideline 

AN-22051900-E1                                                                                      Ver. 1.0.0 

15 

Figure 4-3 Via hole on carbon film 

 

 

4.3

 

Notes 

 

First of all, the layout should consider the placement of the chip, based on the antenna, and reserve 

enough space for the antenna first, so as to determine the location of the chip. 

 

According to the board structure requirement, place the components (battery holder, keys, MIC, and 

etc., while paying attention that do not place components in the location column area). 

 

The components used for RF matching are close to the RF pins. The ANT circuit is isolated from the 

chip and other circuits by ground to avoid signal crosstalk. The capacitors of the LC filter are placed 

on both sides of the RF routing as shown in Figure 4-4. The purpose of placing on both sides of the 

RF routing is to allow better harmonic regulation. It is best to place a 0R (0 ohm) resistor at its RF 

end to improve ground return on both sides of the RF circuit, as shown in Figure 4-4. 

 

The placement of the various capacitors needs to be arranged as suggested below, as shown in Figure 

4-5. 

Содержание FR1

Страница 1: ...Telink FR1 PCB Design Guideline AN 22051900 E1 Ver 1 0 0 2022 05 19 Keyword Layout FR1 PCB Brief This is Telink FR1 PCB design guideline which mainly introduces considerations when designing FR1 boards ...

Страница 2: ...document or any products herein This document may contain technical inaccuracies or typographical errors Telink Semiconductor disclaims any and all liability for any errors inaccuracies or incompleteness contained herein Copyright 2022 Telink Semiconductor Shanghai Co Ltd Information For further information on the technology product and business term please contact Telink Semiconductor Company www...

Страница 3: ...Telink FR1 PCB Design Guideline AN 22051900 E1 Ver 1 0 0 3 Revision History Version Change Description Date Author V1 0 0 Initial release 2022 05 Junyao MAO Weixiang WANG ...

Страница 4: ...lbe layer board 8 2 2 1 Component and copper wire layer carbon film alignment layer 8 2 2 2 Component and copper wire layer carbon film and copper wire layer 9 3 Key Points of FR1 Board Design 10 3 1 Board layer 10 3 1 1 Board thickness selection 10 3 1 2 Introduction of board structure 10 3 2 Carbon film routing 11 4 Layout Regulations 13 4 1 Package 13 4 2 Solder pads and vias 13 4 3 Notes 15 5 ...

Страница 5: ...r routing carbon film routing 9 Figure 3 1 Stack structure 10 Figure 3 2 Carbon film routing 12 Figure 4 1 Package forms 13 Figure 4 2 Package design for Telink IC 14 Figure 4 3 Via hole on carbon film 15 Figure 4 4 Layout for RF circuit 16 Figure 4 5 Layout for power capacitors 17 Figure 5 1 Routing example 1 19 Figure 5 2 Routing example 2 19 Figure 5 3 Routing example 3 20 ...

Страница 6: ...cost concern PCB designs are increasingly preferred to use FR1 boards single layer boards which leads to more obvious problems in wireless communication including power interference RF high harmonics and etc This document uses the Telink SoC chips as a basis and the remote control design as an example to illustrate how to guide the design of FR1 boards to achieve fast development and avoid multipl...

Страница 7: ...chips can be divided into single layer boards or double layer boards 2 1 Single layer board In single layer board design make sure that all components and keys can be placed on the same side and there should be enough space for the PCB antenna This is suitable for boards with a small number of components and routings The remote control board shown below can be designed as a single layer board Figu...

Страница 8: ...is for carbon film routing For example in a remote control design we place the components on one layer and the keys on the other layer The keys need to be designed as carbon film keys and the keys routing is connected to the component layer via carbon film via holes Note that carbon film vias are chosen for cost concerns The remote control board shown below can be designed as this type of double l...

Страница 9: ...he keys need to be designed as carbon film keys and the keys routing is connected to the component layer via carbon film via holes When there are many components and the routing is complex if the design shown in 2 2 1 cannot be completed routing then in addition to the carbon film routing on another layer it is necessary to add copper routing and connect the component side routing through the carb...

Страница 10: ...be 1 2mm or 1 0mm Note 1 CEM 1 is more suitable for making thinner boards than FR1 and CEM 1 is less likely to warp boards than FR1 over wave soldering 2 Whether FR1 or CEM 1 is used the rules and notes for PCB design are the same 3 1 2 Introduction of board structure In general FR1 circuit board is single surface board however we need create another layer in addition to the Top layer and Bottom l...

Страница 11: ...il on one side 0 05mm 113 Diameter of insulated opening 1 6mm 0 1mm greater than copper plate on one side when insulated 114 Diameter of the carbon film on the surface of the grouting hole 1 8mm When there is no protective oil in principle the carbon film is required to be 0 2mm larger on one side of the copper plate to avoid revealing copper When it is not possible to meet the carbon film single ...

Страница 12: ...and the edge of the green oil covered wire 0 5mm The principle is to avoid short circuits caused by carbon oil seepage in case of pinholes in the single layer of green oil the edge of the carbon plate is at least 0 1mm from the insulation layer covering the wire when there is an insulation layer underneath the carbon film 121 Carbon hole resistance 100 ohms hole 122 Carbon hole reliability design ...

Страница 13: ... MIC are shown in the figure below Figure 4 1 Package forms 4 2 Solder pads and via holes The PCB package design of Telink IC is as shown in Figure 4 2 The carbon film via hole is shown in Figure 4 3 the hole diameter is greater than 0 7mm outer diameter 1 4mm The air gap between carbon film hole and copper wire is 2 5mm or more ...

Страница 14: ...Telink FR1 PCB Design Guideline AN 22051900 E1 Ver 1 0 0 14 Figure 4 2 Package design for Telink IC ...

Страница 15: ...omponents in the location column area The components used for RF matching are close to the RF pins The ANT circuit is isolated from the chip and other circuits by ground to avoid signal crosstalk The capacitors of the LC filter are placed on both sides of the RF routing as shown in Figure 4 4 The purpose of placing on both sides of the RF routing is to allow better harmonic regulation It is best t...

Страница 16: ...must be filtered through a capacitor The power supply route is the positive end of the battery spring tab the filter capacitor the power pin of the chip The filter capacitor for the chip s power pin should be placed as close as possible to the corresponding pin of the chip Figure 4 4 Layout for RF circuit ...

Страница 17: ...Telink FR1 PCB Design Guideline AN 22051900 E1 Ver 1 0 0 17 Figure 4 5 Layout for power capacitors ...

Страница 18: ...und with wires after the power routing is completed giving priority to ensuring that the ground line can go through and adding the 0R cross line resistor at locations where it has blocks Ground wire should be as thick as 1mm and above and routed in a ground shape Routing does not require excessive division of the ground plane that is the same direction routing is together and the routing distance ...

Страница 19: ...ting example 1 In order to make a good connection between the chip and the ground and improve the RF performance it can be connected to the system ground through the chip s four corner ground as shown in the location of the red arrow in Figure 5 2 Figure 5 2 Routing example 2 ...

Страница 20: ...plete for the copper plates where the ground plane is disconnected from the chip ground or power ground due to the routing we should use 1206 package resistor to across the line to make it connected with the chip ground or power ground copper as shown in Figure 5 3 Figure 5 3 Routing example 3 ...

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