TDK T5919 Скачать руководство пользователя страница 17 | Manualshive

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TDK T5919 Скачать руководство пользователя страница 17

T5919

Page 17 of 22

Document Number: DS-000363

Revision: 1.0

SUPPORTING DOCUMENTS

For additional information, see the following documents.

APPLICATION NOTES

–

GENERAL

AN-000048,

PDM Digital Output MEMS Microphone Flex Evaluation Board User Guide

AN-100,

MEMS Microphone Handling and Assembly Guide

AN-1003,

Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones

AN-1112,

Microphone Specifications Explained

AN-1124,

Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress

AN-1140,

Microphone Array Beamforming

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Содержание T5919

Страница 1: ...20 dB SPL AOP in Low Power mode The T5919 is available in a standard 3 5 2 65 0 98 mm surface mount package It is reflow solder compatible with no sensitivity degradation The package integrates a Particle Ingress Filter PIF for enhanced robustness to environmental contaminants such as water and dust APPLICATIONS Smartphones Microphone Arrays Tablet Computers Cameras FEATURES SPEC HIGH QUALITY MODE...

Страница 2: ...6 Absolute Maximum Ratings 7 Table 6 Absolute Maximum Ratings 7 ESD Caution 7 Soldering Profile 8 Table 7 Recommended Soldering Profile 8 Pin Configurations And Function Descriptions 9 Table 8 Pin Function Descriptions 9 Typical Performance Characteristics 10 Theory Of Operation 12 PDM Data Format 12 Table 9 T5919 Channel Setting 12 PDM Microphone Sensitivity 12 Applications Information 14 Low Pow...

Страница 3: ...T5919 Page 3 of 22 Document Number DS 000363 Revision 1 0 Board Wash 19 Outline Dimensions 20 Ordering Guide 20 Revision History 21 Compliance Declaration Disclaimer 22 ...

Страница 4: ...al to Noise Ratio SNR 20 kHz bandwidth A weighted 64 5 dBA Equivalent Input Noise EIN 20 kHz bandwidth A weighted 29 5 dBA SPL Acoustic Dynamic Range Derived from EIN and acoustic overload point 105 5 dB Total Harmonic Distortion THD 94 dB SPL 0 15 Low Frequency Roll Off 3dB relative to 1kHz Sensitivity 40 Hz Power Supply Rejection PSR 20 Hz 100 mVpp applied to VDD 1 kHz 100 mVpp applied to VDD 5 ...

Страница 5: ...B SPL 0 15 Power Supply Rejection PSR 217 Hz 100 mV p p square wave superimposed on VDD 1 8 V A weighted 90 dB FS Power Supply Rejection Swept Sine 1 kHz sine wave 99 dB FS Acoustic Overload Point 10 THD 120 dB SPL Supply Current IS VDD 1 8 V no load 220 µA Note 2 Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100 1s density and negative amplitude equal to...

Страница 6: ...er and High Quality Mode 7 ms INPUT tCLKIN Input clock period 303 2500 ns Clock Frequency CLK Sleep Mode 200 kHz Low Power Mode 400 800 kHz High Quality Mode 2 0 3 3 MHz Clock Duty Cycle fCLK 3 3 MHz 45 55 tRISE CLK rise time 10 to 90 level 25 ns 3 tFALL CLK fall time 90 to 10 level 25 ns 3 OUTPUT t1OUTEN DATA1 right driven after falling clock edge 30 ns t1OUTDIS DATA1 right disabled after rising ...

Страница 7: ...TER RATING Supply Voltage VDD 0 3 V to 3 63 V Digital Pin Input Voltage 0 3 V to VDD 0 3 V or 3 63V whichever is less Mechanical Shock 10 000 g Vibration Per MIL STD 883 Method 2007 Test Condition B Temperature Range Operating 40 C to 85 C Storage 55 C to 150 C ESD CAUTION ESD electrostatic discharge sensitive device Charged devices and circuit boards can discharge without detection Although this ...

Страница 8: ... 1 25 C sec 1 25 C sec Time Maintained Above Liquidous tL 45 sec to 75 sec 50 sec Liquidous Temperature TL 183 C 217 C Peak Temperature TP 215 C 3 C 3 C 260 C 0 C 5 C Time Within 5 C of Actual Peak Temperature tP 20 sec to 30 sec 20 sec to 30 sec Ramp Down Rate 3 C sec max 3 C sec max Time 25 C t25 C to Peak Temperature 5 min max 5 min max The reflow profile in Table 7 is recommended for board man...

Страница 9: ...DATA2 2 SELECT Left Channel or Right Channel Select DATA 1 right SELECT tied to GND DATA 2 left SELECT tied to VDD In this setting SELECT should be tied to the same voltage source as the VDD pin 3 GND Ground 4 CLK Clock Input to Microphone 5 VDD Power Supply For best performance and to avoid potential parasitic artifacts place a 0 1 µF 100 nF ceramic type X7R capacitor between Pin 5 VDD and ground...

Страница 10: ... Low Power Mode Figure 7 Linearity 20 10 0 10 20 30 10 100 1000 10000 NORMALIZED AMPLITUDE dB FREQUENCY Hz 0 01 0 1 1 10 90 95 100 105 110 115 120 125 130 135 THD N INPUT AMPLITUDE dB SPL High Quality Mode 0 01 0 1 1 10 90 95 100 105 110 115 120 THD N INPUT AMPLITUDE dB SPL Low Power Mode 50 40 30 20 10 0 90 100 110 120 130 OUTPUT AMPLITUDE dB FS INPUT AMPLITUDE dB SPL High Quality Mode Low Power ...

Страница 11: ...5919 Page 11 of 22 Document Number DS 000363 Revision 1 0 Figure 8 Power Supply Rejection PSR vs Frequency 140 120 100 80 60 40 20 0 100 1000 10000 PSR dB FS FREQUENCY Hz High Quality Mode Low Power Mode ...

Страница 12: ... is not enough to discharge the line while the driver is tristated Figure 10 Mono PDM Format See Table 9 for the channel assignments according to the logic level on the SELECT pin The setting on the SELECT pin is sampled at power up and should not be changed during operation TABLE 9 T5919 CHANNEL SETTING For PDM data the density of the pulses indicates the signal amplitude A high density of high p...

Страница 13: ... an RMS level of 29 dB FS however this is not true because of the definition of the 0 dB FS sine wave Figure 11 1 kHz 0 dB FS Sine Wave There is not a commonly accepted unit of measurement to express the instantaneous level as opposed to the RMS level of the signal of a digital signal output from the microphone Some measurement systems express the instantaneous level of an individual sample in uni...

Страница 14: ...y use the 106 dB dynamic range of the output data of the T5919 in a design the digital signal processor DSP or codec circuit following it must be chosen carefully The decimation filter that inputs the PDM signal from the T5919 must have a dynamic range sufficiently better than the dynamic range of the microphone so that the overall noise performance of the system is not degraded If the decimation ...

Страница 15: ...apacitive load a digital buffer may be required Only use a signal buffer on the DATA line when one microphone is in use or after the point where two microphones are connected see Figure 14 The DATA output of each microphone in a stereo configuration cannot be individually buffered because the two buffer outputs cannot drive a single signal line If a buffer is used take care to select one with low ...

Страница 16: ...ut is in a high impedance state The current consumption in sleep mode is 9 µA The microphone wakes up from sleep mode and begins to output data 7 ms after the clock becomes active The wake up time indicates the time from when the clock is enabled to when the T5919 outputs data within 0 5 dB of its settled sensitivity START UP TIME The start up time of the T5919 is typically 7 ms measured by the ti...

Страница 17: ...tal Output MEMS Microphone Flex Evaluation Board User Guide AN 100 MEMS Microphone Handling and Assembly Guide AN 1003 Recommendations for Mounting and Connecting the TDK Bottom Ported MEMS Microphones AN 1112 Microphone Specifications Explained AN 1124 Recommendations for Sealing TDK Bottom Port MEMS Microphones from Dust and Liquid Ingress AN 1140 Microphone Array Beamforming ...

Страница 18: ...ole in the microphone package with the hole in the PCB The exact degree of the alignment does not affect the microphone performance as long as the holes are not partially or completely blocked Figure 15 Recommended PCB Land Pattern Layout Figure 16 Suggested Solder Paste Stencil Pattern Layout PCB MATERIAL AND THICKNESS The performance of the T5919 is not affected by PCB thickness The T5919 can be...

Страница 19: ...he microphone with a vacuum tool that makes contact with the bottom side of the microphone Do not pull air out of or blow air into the microphone port Do not use excessive force to place the microphone on the PCB REFLOW SOLDER For best results the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB I...

Страница 20: ... No Lead Cavity LGA_CAV 3 5 mm 2 65 mm 0 98 mm Body Dimensions shown in millimeters Dimension tolerance is 0 15 mm unless otherwise specified Figure 18 Package Marking Specification Top View ORDERING GUIDE PART TEMP RANGE PACKAGE QUANTITY PACKAGING MMICT5919 00 012 40 C to 85 C 5 Terminal LGA_CAV 10 000 13 Tape and Reel 919 ...

Страница 21: ...T5919 Page 21 of 22 Document Number DS 000363 Revision 1 0 REVISION HISTORY REVISION DATE REVISION DESCRIPTION 3 9 21 1 0 Initial version ...

Страница 22: ...on contained in this document or from the use of products and services detailed therein This includes but is not limited to claims or damages based on the infringement of patents copyrights mask work and or other intellectual property rights Certain intellectual property owned by TDK and described in this document is patent protected No license is granted by implication or otherwise under any pate...

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