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Chapter 3: Maintenance and Component Installation
The Intel Xeon SP Series Processor
Non-Fabric Model
3.3 Motherboard Components
Processor and Heatsink Installation
Intel
®
Xeon
®
Scalable Processors come in two models: Fabric (F model) and Non-Fabric
(Non-F model). Only the Non-Fabric model is supported for this system.
The processor (CPU) and heatsink should be assembled together first to form the processor
heatsink module (PHM), and then install the PHM into the CPU socket.
Caution:
Use ESD protection. Do not touch the underside of the CPU. Improper installation
or socket misalignment can cause serious damage to the CPU or socket which may require
manufacturer repairs.
Notes:
•
All power should be off, as described in Section 3.1, before installing the processors.
•
When handling the processor package, avoid placing direct pressure on the label area of
the CPU or socket.
•
Check that the plastic socket dust cover is in place and none of the socket pins are bent—
otherwise, contact your retailer.
•
Refer to the Supermicro website for updates on CPU support.
•
Graphics in this manual are for illustration. Your components may look slightly different.
