Appendix E: System Specifications
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Appendix E
System Specifications
Processors
Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647)
Note:
Please refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel®C621 chipset
BIOS
32Mb AMI UEFI
Memory
Supports up to 2 TB of registered ECC DDR4-2666 RDIMM (Registered DIMM) or LRDIMM (Load-Reduced DIMM) memory;
16 DIMM slots
Note:
See the memory section in Chapter 3 for details and our website for updates to supported memory.
SATA Controller
On-chip (Intel®C621 ) controller
Drive Bays
Eight hot-swap 3.5" drive bays and two 5.25" drive bays
PCI Expansion Slots
Two PCI Express 3.0 x16 slots
Two PCI Express 3.0 x16 slots (or four PCI-E 3.0 x 8 by MUX)
Four PCI Express 3.0 x8 slots
One PCI Express 3.0 x4 (in x8 slot)
Motherboard
X11DPX-T; Proprietary form factor (15.12 x 13.2 in. / 384 x 335.3 mm (L x W)
Chassis
CSE-835XTS-R982BP; 3U Rackmount, 17.2 x 5.2 x 25.5 in. / 437 x 132 x 648 mm. (W x H x D)
Gross Weight
72 lbs (32.6 kg)
System Cooling
Three middle and one rear exhaust fans
Power Supply
850W/980W high efficiency (94%+) AC-DC Redundant power supplies with PMBus
AC Input Voltages: 100-240 VAC
Rated Input Current: 11.5A (100V) to 4.54A (240V)
Rated Input Frequency: 50-60 Hz
Rated Output Power: 850W/980W
Rated Output Voltages: +5Vsb, 12V
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
