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Appendix B: System Specifications
System Specifications
Processors
Dual 3rd Generation Intel® Xeon® Scalable processorss in an LGA4189 socket; UPI up to 10.4GT/s; supports CPU TDP up to
205W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621A
BIOS
AMI 256Mb SPI Flash EEPROM
Memory
32 DIMM slots for up to 8TB 3DS ECC DDR4-3200:RDIMM/LRDIMM or 18TB Intel® Optane™ DDR4-2666:DCPMM, RDIMM/
LRDIMM//DCPMM
Storage Drives
12x PCI E 4.0 X16
1x Supermicro AIOM / OCP 3.0
Two M.2 NVMe/SATA3
PCI Expansion Slots
12 PCI E 4.0 X16
One Supermicro AIOM / OCP 3.0
Two M.2 NVMe/SATA3
Input/Output
Two 1GbE LAN ports
One RJ45 dedicated BMC LAN port
Two USB 3.0 ports / one VGA port
One COM (serial port) header
Motherboard
X12DPG-OA6: 17.0 x 15" (431.8 x 381 mm)
Chassis
CSE-218HTS-R2K08P; 4U Rackmount, 17.2 x 7 x 29in. / 437 x 178 x 737mm (WxHxD)
System Cooling
Four 8-cm heavy duty fans
One air shroud