8
Layout recommendations
It is important to have a whole ground plane below Teseo-LIV4F module. Avoid any signals below Teseo-LIV4F.
Do not place the module close to any EMI source, like antenna, RF routing, DC/DC or power conductor, clock
signal or other high-frequency switching signal, etc.
For RF passive components, ST recommends using of 0402 (1 x 0.5 mm) components. Please choose the RF
ground layer to be able to get 50 Ω RF line width as close as possible to components pads.
On 50 Ω RF line it is important to avoid all possible stubs:
•
For parallel components place one pad on the RF line.
Figure 7.
Parallel component pads position
50Ω line
50Ω line
50Ωline
•
If a bypass is needed, superimpose the two pads in one.
Figure 8.
Bypass components pads position
50Ω line
50Ω line
50Ω line
50Ω line
50Ω
line
50Ω
line
UM3004
Layout recommendations
UM3004
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Rev 1
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