8.1
Top layer
On the Top layer all components are placed. Therefore all component connections are done on this layer. All RF
routing including 50 Ω - coplanar wave guide with ground plane, 100 Ω differential traces are done on the top
layer. Ground terminals of components have no thermal relief-connect to the ground plane.
Figure 27.
Layout - top layer
1.
Green line = 50 Ω complanar wave-guides withground floor.
Blue line = 100 Ω differential wave-guides
UM2353
Top layer
UM2353
-
Rev 2
page 36/48
Содержание ST25RU3993-EVAL
Страница 25: ...Figure 16 Schematic of UHF RFID reader device UM2353 Rev 2 page 25 48 UM2353...
Страница 26: ...Figure 17 Schematic of external power amplifier UM2353 Rev 2 page 26 48 UM2353...
Страница 28: ...Figure 20 Schematic of USB supply UART bridge UM2353 Rev 2 page 28 48 UM2353...
Страница 29: ...Figure 21 Schematic of microcontroller UM2353 Rev 2 page 29 48 UM2353...
Страница 30: ...Figure 22 Schematic of supply LDOs UM2353 Rev 2 page 30 48 UM2353...
Страница 31: ...Figure 23 Schematic of external interfaces and connections UM2353 Rev 2 page 31 48 UM2353...
Страница 32: ...Figure 24 Schematic of BT classic module UM2353 Rev 2 page 32 48 UM2353...
Страница 33: ...Figure 25 Schematic of RF shield UM2353 Rev 2 page 33 48 UM2353...
Страница 39: ...8 4 GND layer Figure 30 Layout GND layer UM2353 GND layer UM2353 Rev 2 page 39 48...