KE-50XBR900(UC) 4-57
1
A
B
C
D
E
F
G
H
I
J
2
12
13
11
10
9
8
7
6
5
4
3
14
15
(10) Schematic Diagram of MS2 Board
+3.3V
+3.3V
+3.3V
0
0
0
3.3
0
1.0
0
0
0
0
0
0
1.4
0
1.3
1.0
3.0
3.0
0
3.1
0
3.2
0
3.3
0
LVDS RECEIVER
LVDS DRV
BUS SW
DIR+
DIR-
DE
BS
BS+
BS-
GND
EN
CK-
CK+
CK
DO
DO+
DO-
EN
VCC
DI2
DI1
VCC
GND
DI+
DI-
DO-
DO+
DE
GND
A
DO
VCC
B-SS11282<CH.>-MS2
(MEMORY STICK)
TO B4 BLOCK
STICK
MEMORY
LED SW
LED DRIVE
VCC SW
MS2
GND
+3.3VD
MS_INS
GND
GND
GND
CASE
MS_SDI-
MS_SDO-
GND
GND
MS_SCLK-
MS_SDIR-
MS_BS-
MS_BS+
GND
MS_BS
VCC
MS_SDIO
NC
MS_INS
NC
MS_SCLK
VCC
GND
1
2
3
4
1
2
3
4
1
2
3
4
1
2
3
4
1
2
3
4
1
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
1
2
3
4
5
CN1402
R1431
D1410
R1428
C1413
C1414
L4101
L1402
L1403
L1404
L1405
R1422
D1409
Q1401
R1421
CN1401
R1401
R1402
R1403
R1404
D1411
D1401
D1402
R1405
D1403
D1404
C1419
CN1404
C1416
C1417
Q1403
R1425
FB1403
R1426
IC1403
R1424
C1415
Q1402
D1417
D1412
R1409
D1416
D1408
D1407
D1415
R1408
R1410
D1406
R1407
R1406
D1413
D1405
IC1401
FB1401
C1408
C1406
C1405
C1410
C1409
IC1402
FB1404
FB1402
C1420
C1412
D1414
18P
WHT
:PHD
0
1/16W
:CHIP
MM3Z3V9ST1
0
1/16W
:CHIP
22
6.3V
:HT-CP
0.1
16V
B:CHIP
PLW3216S261SQ
PLW3216S261SQ
PLW3216S261SQ
PLW3216S261SQ
PLW3216S261SQ
100
1/16W
:CHIP
KPA-3010ID
2SA1611-T1-M5M6
1k
1/16W
:CHIP
10P
22
1/16W
:CHIP
22 1/16W :CHIP
22 1/16W :CHIP
22
1/16W
:CHIP
MM3Z3V9ST1
MA133-TX
MA133-TX
1k
1/16W
:RN-CP
MA133-TX
MA133-TX
0.01
25V
B:CHIP
0P
:TAB
0.1
16V
B:CHIP
22
6.3V
:HT-CP
2PB709AR-115
100k
1/16W
:CHIP
BK1608TS601
10k
1/16W
:RN-CP
SN74CBTLV1G125DC
10k
1/16W
:CHIP
0.1
16V
B:CHIP
DTC144EVA-T106
MA133-TX
MA133-TX
100
1/16W
:CHIP
MA133-TX
MA133-TX
MA133-TX
MA133-TX
100
1/16W
:CHIP
33
1/16W
:CHIP
MA133-TX
100
1/16W
:CHIP
100
1/16W
:CHIP
MA133-TX
MA133-TX
SN65LVDS32DR
BK1608TS601
10
16V
:AL-CP
0.01
B:CHIP
0.1
25V
F:CHIP
0.01
B:CHIP
0.1
25V
F:CHIP
SN65LVDS1DR
BK1608TS601
BK1608TS601
0.01
25V
B:CHIP
0.1
25V
F:CHIP
MA133-TX
MS_BUS
MS_DATA
MS_SCLK
MS_INS
+3.3VD
+3.3VD
+3.3VD
+3.3VD
+3.3VD
+3.3VD
+3.3VD
Содержание WEGA KE-50XBR900, KE-42XBR900
Страница 11: ...KE 50XBR900 UC 1 2 1 1 2 K AND F BOARDS REMOVAL 3 Four screws PSW 3X8 1 Two screws PSW 3X8 2 F Board 4 K Board ...
Страница 17: ...KE 50XBR900 UC 1 8 1 2 2 H1 BOARD REMOVAL 1 Two screws BVTP 3X12 2 H1 Board 1 Two screws BVTP 3X12 Front panel ...
Страница 18: ...KE 50XBR900 UC 1 9 1 2 3 H4 BOARD REMOVAL 1 Two screws BVTP 3X12 2 H4 Board Front panel ...
Страница 19: ...KE 50XBR900 UC 1 10 1 2 4 H3 BOARD REMOVAL 1 Three screws BVTP 3X12 2 H3 Board Front panel ...
Страница 21: ...KE 50XBR900 UC 1 12 1 2 6 H2 BOARD REMOVAL 1 Two screws M 3X8 P SW 2 H2 Board ...
Страница 23: ...KE 50XBR900 UC 1 14 1 2 8 B BLOCK ASSY REMOVAL 1 B Block assy ...
Страница 24: ...KE 50XBR900 UC 1 15 1 2 9 M AD AND AU BOARDS REMOVAL 2 Shield case 1 Screw PSW 3x8 ...
Страница 26: ...KE 50XBR900 UC 1 17 1 2 11 M BOARD REMOVAL 2 Screw PSW 3x8 3 M Board 1 Shield case upper Shield case main ...
Страница 27: ...KE 50XBR900 UC 1 18 1 2 12 IF BOARD REMOVAL 1 IF Shield sheet 3 IF Board B Block assy 2 Screw PSW 3x8 ...
Страница 28: ...KE 50XBR900 UC 1 19 1 2 13 U1 BOARD REMOVAL 1 Four screws BVTP 3x12 2 U1 Board 3 Core FPC ...
Страница 29: ...KE 50XBR900 UC 1 20 1 2 14 U2 BOARD REMOVAL 1 Tow screws BVTP 3x12 2 U2 Board Rear panel ...
Страница 75: ...KE 50XBR900 UC 4 40 AD AV SW COMPONENT I F DVI AD BOARD COMPONENT SIDE CONDUCTOR SIDE 1 2 A B C D 1 2 A B C D ...
Страница 203: ...KE 50XBR900 UC 202 Sony EMCS Corporation Ichinomiya TEC 9 978 756 02 English 2003BL08 Data Made in Japan 2003 2 ...