Sony MDR-NC300D, Руководство по обслуживанию

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MDR-NC300D
MDR-NC300D
9 9
• IC Block Diagrams
– MAIN Board –
IC302 – 304 TK63714AB6GHB-C
– SUB Board –
IC403, 406, 407 TK63715AB6GHB-C
IC404, 405 TK63728AB6GHB-C
IC408, 409 XC9128D45CDR
For Schematic Diagrams.
Note:
• All capacitors are in μ F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
speci fi ed.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Signal path.
F
: AUDIO
N
: MIC
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
For Printed Wiring Boards.
Note:
•
Y
: Parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
• MAIN and SUB boards are multi-layer printed wiring
board. However, the patterns of intermediate-layers have
not been included in diagrams.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A) Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Lead layouts
surface
CSP (Chip Size Package) Lead layout of conventional IC
A1 GND B2 VIN
B1 VOUT A2 VCONT
ON/OFF
CONTROL
VREF
+
–
THERMAL &
OVER CURRENT
PROTECTION
A1 GND B2 VIN
B1 VOUT A2 VCONT
ON/OFF
CONTROL
VREF
+
–
THERMAL &
OVER CURRENT
PROTECTION
DRIVER
10 VOUT
9 MODE
8 FB
7 AGND
6 AEN/
1
PGND
2 Lx
3 BAT
4
EN
5 FO
CURRENT SENSE,
LIMIT, PFM
EN,
THERMAL SHUTDOWN
VREF WITH
SOFT START
PWM
COMPARATOR
PHASE
COMPENSATION
ERROR
AMP.
PWM/PFM
CONTROLLER,
LOGIC
CURRENT LIMIT,
THERMAL,
SOFT START,
EN
RAMP WAVE
GENERATOR
OSC MODE