ICF-SW100E/SW100S
– 15 –
– 16 –
1-6. PRINTED WIRING BOARD – MICROCOMPUTER BOARD (SIDE B) –
RB628
RB626
RB627
RB625
RB624
RB603
RB619
RB618
RB610
RB617
RB616
RB604
RB631
RB605 RB606
RB614
RB613
RB612
RB615
RB607 RB608
RB609
RB629
RB630
RB611
RB620
RB621
RB622 RB623
RB601
RB602
1
1
1
CN602
18
1
CN601
16
41
41
40
40
21
21
20
20
80
80
61
61
60
60
SP601
SPEAKER
1
3
IC602
IC601
1
3
D602
D603
D601
IC607
1
3
IC605
1
3
IC606
1
4
5
8
C629
C616
Q603
Q601
Q602
ECB
BCE
BCE
D606
D607
R614
R620
R601
R603
R607
R611
R621
C602
C603 C604
C605
C606
C607
C608
R602
R612
R606
R609
R610
R616
C631
C614
C601
R622
R619
R624
R613
C622
C621
C620
C632
C623
C618
C617
C613
R617
R608
R618
R623
R615
C619
C628
C630
C627
C626
C625
C624
C611
C610
C609
C612
MICROCOMPUTER BOARD (SIDE B)
17
(17)
1-651-254-
X601
2
3
4
5
A
1
B
C
D
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
x
: parts extracted from the conductor side.
•
z
: Through hole.
•
: Pattern from the side which enables seeing.
(The other layers´ Patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side A)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side B)
parts face are indicated.
Ref. No.
Location
• Semiconductor
Location
D601
B-1
D602
C-1
D603
C-1
D606
B-4
D607
C-4
IC601
A-1
IC602
A-1
IC603
B-2
IC604
B-3
IC605
B-4
IC606
C-3
IC607
C-4
Q601
B-1
Q602
C-1
Q603
B-1
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9
9
2
8
9
4
2
9
8
T E L
1 3 9 4 2 2 9 6 5 1 3
9
9
2
8
9
4
2
9
8
0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299
