HVR-M10C/M10E/M10J/M10N/M10P/M10U
4-15
4-16
HP-139/JL-001/FP-090/FP-096
0uH
FB701
0uH
FB703
0
R701
4P
CN701
1
2
3
4
VDR701
VDR702
J701
2 L
4 R
1 GND
3 S
LND701
CHASSIS GND
LND702
CHASSIS GND
XX
C701
XX
C702
1
A
HP_CH1(L)
AU_GND
HP_CH2(R)
AU_GND
PHONES
HP JACK
HP-139 BOARD
4
5
B
16
3
2
FP-096 FLEXIBLE BOARD
is replaced as a block.
So that this PRINTED
WIRING BOARD is omitted.
0
R902
0
R901
0
R903
LND901
01ZA8.2(TPL3)
D931
1
2
3
0uH
FB932
0uH
FB933
UDZSTE-178.2B
D932
0uH
FB931
LND931
J931
1 SIG
2 LANC_DC
3 GND
4 232C_TD
5 JACK_IN
LND921
12P
CN901
1
2
3
4
5
6
7
8
9
10
11
12
NSAD500S-T1
D904
1
2
3
NSAD500S-T1
D903
1
2
3
NSAD500S-T1
D902
1
2
3
10P
CN902
1
2
3
4
5
6
7
8
9
10
4P
LF921
5
6
7
8
4
3
2
1
CN921
1
NTPB
2
TPB
3
NTPA
4
TPA
J901
1 R
2 R-GND
3 B
4 B-GND
5 G
6 G-GND
10P
1
2
3
4
5
6
7
8
9
10
12P
1
2
3
4
5
6
7
8
9
10
11
12
10P
1
2
3
4
5
6
7
8
9
10
12P
1
2
3
4
5
6
7
8
9
10
11
12
1
A
COMPONENT OUT
CHASSIS GND
COMP_GND
COMP_GND
COMP_Y
COMP_GND
COMP_PR
COMP_PB
LANC_SIG
REG_GND
XLANC_JACK_IN
REG_GND
LANC_DC
REG_GND
REG_GND
TPB
NTPA
TPA
NTPB
N.C.
REG_GND
CHASSIS GND
N.C.
N.C.
CHASSIS GND
COMP_GND
HDV/DV
LANC
MT_4.9V
ILINK_DV_LED
NTPA
NTPB
ILINK_HDV_LED
TPB
TPA
REG_GND
REG_GND
REG_GND
COMP_GND
LANC_SIG
LANC_DC
COMP_GND
REG_GND
COMP_GND
COMP_PB
COMP_GND
XLANC_JACK_IN
COMP_Y
COMP_PR
REG_GND
TPB
NTPA
TPA
NTPB
N.C.
N.C.
REG_GND
REG_GND
REG_GND
N.C.
LANC_DC
COMP_Y
REG_GND
COMP_GND
COMP_GND
COMP_GND
REG_GND
COMP_PR
LANC_SIG
COMP_GND
COMP_PB
XLANC_JACK_IN
RELAY
RELAY
FP-090
FLEXIBLE BOARD
FP-096
FLEXIBLE BOARD
JACK
JL-001 BOARD
6
E
7
16
8
4
3
10
2
B
D
5
F
C
9
For Schematic Diagram
• Refer to page 4-85 for printed wiring board of JL-001 and FP-090.
• Refer to page 4-83 for printed wiring board of HP-139.
Содержание HVR-M10C
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