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2
HCD-NEZ30
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
Note for Printed Wiring Boards and Schematic Diagrams
2.
DIAGRAMS
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
•
Signal path.
F
: TUNER
•
Abbreviation
CND : Canadian model
EE
: East European model
2-1. PRINTED WIRING BOARD – HEAD PHONE Board –
: Uses unleaded solder.
JW
2
4
1
JW238
JW239
JW231
JW240
JW240
JW247
JW245
JW244
J500
R530
R519
R525
R526
R528
R527
R520
R532
R534
R533
R531
R529
R541
R542
R543
R544
R545
R546
R547
R548
1
13
HEAD PHONE BOARD
1-869-177-
PHONES
(CHASSIS)
FFC501
MAIN
BOARD
CN500
A
B
C
D
1
2
3
4
EPT500
C521
C520
(EXCEPT US, CND)
(EXCEPT UK, EE)
(UK, EE)
JR501
(US, CND)
13, 14
(13, 14)
R527
R525
R519
R520
R526
R528
J500
EPT500
R533
R531
R529
R534
R532
R530
R541
R542
R544
R546
R548
R545
R547
C520
C521
470
470
470
470
470
470
220
220
220
220
220
220
JR501
JW240
JW240 0.45
µ
H
0
10k
10k
10k
10k
10k
10k
10k
0.01
0.01
HPGND
HP-R
SP-L
SP-R
HP-L
HP-L
HP-R
HP-R
SP-L
SP-L
MAIN
BOARD
(1/2)
CN500
SP-R
SP-R
FFC501
13
(CHASSIS)
PHONES
(EXCEPT US,CND)
(US,CND)
(EXCEPT UK,EE)
(UK,EE)
2-2. SCHEMATIC DIAGRAM – HEAD PHONE Board –
www. xiaoyu163. com
QQ 376315150
9
9
2
8
9
4
2
9
8
TEL 13942296513
9
9
2
8
9
4
2
9
8
0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299