35
35
HCD-DZ830W/DZ850KW
HCD-DZ830W/DZ850KW
• Circuit Boards Location
(DZ830W)
(DZ850KW)
IO-S-OUT board
DMPORT board
(EXCEPT E32, MX)
FL board
JACK board
P-SW board
IO-SCART board
DMPORT board
DIAT-TX board
SPEAKER board
MAIN board
HEATSINK B board
INSULATOR board
SUPPORT board
HEATSINK A board
TUNER (FM/AM)
POWER board
DSP board
DSP board
MS-203 board
FL board
JACK board
P-SW board
DIAT-TX board
SPEAKER board
MAIN board
HEATSINK B board
INSULATOR board
SUPPORT board
HEATSINK A board
TUNER (FM/AM)
POWER board
MS-203 board
• Waveforms
– MAIN Board –
– IO-SCART Board – (DZ830W)
2
IC1101
<xcv
(XTALI)
1 V/DIV, 10 ns/DIV
37 ns
3.3 Vp-p
1
IC1101
6
(DVDRFIP)
200 mV/DIV, 100 ns/DIV
900 mVp-p
3
IC1101
<z,m
(CVBS)
500 mV/DIV, 20
µ
s/DIV
H
1.5 Vp-p
5.0 Vp-p
20.3 ns
5
IC3010
rk
(XFSOIN)
1 V/DIV, 10 ns/DIV
4
IC501
qg
(XIN)
1 V/DIV, 100 ns/DIV
200 ns
3.0 Vp-p
4
IC230
wf
(CYOUTa)
5
IC230
wa
(CbOUTa)
6
IC230
qk
(CrOUTa)
1
IC201
wf
(CYOUTa)
2
IC201
wa
(CbOUTa)
3
IC201
qk
(CrOUTa)
500 mV/DIV, 20
µ
s/DIV
H
1.7 Vp-p
500 mV/DIV, 20
µ
s/DIV
1.7 Vp-p
H
500 mV/DIV, 20
µ
s/DIV
1.7 Vp-p
H
1 V/DIV, 20
µ
s/DIV
2 Vp-p
H
1.8 Vp-p
H
500 mV/DIV, 20
µ
s/DIV
500 mV/DIV, 20
µ
s/DIV
H
1.5 Vp-p
– IO-S-OUT Board – (DZ850KW)
1
IC308
wh
(C OUT)
2
IC308
wa
(Y OUT)
3
IC308
w;
(CY OUT)
4
IC308
qk
(Cb OUT)
5
IC308
qh
(Cr OUT)
1 V/DIV, 20
µ
s/DIV
H
1.3 Vp-p
1 V/DIV, 20
µ
s/DIV
2 Vp-p
H
1 V/DIV, 20
µ
s/DIV
2 Vp-p
H
1.8 Vp-p
H
500 mV/DIV, 20
µ
s/DIV
500 mV/DIV, 20
µ
s/DIV
H
1.5 Vp-p
– DSP Board –
1
IC1804
tj
(OSC1)
40.6 ns
2.3 Vp-p
500 mV/DIV, 20 ns/DIV
– DIAT-TX Board –
1
IC002
<zvx
(CLKIN)
40 ns
1.9 Vp-p
1 V/DIV, 20 ns/DIV
Ver. 1.1
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
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T E L
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9
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2
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2
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0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299
http://www.xiaoyu163.com
http://www.xiaoyu163.com
