D-NE330/NE331
13
13
D-NE330/NE331
4-5. PRINTED WIRING BOARD – MAIN Board (Conductor Side) –
When MAIN board is replaced or EEPROM (IC802) on the MAIN board is
replaced, patch processing is needed.
Confirm about information of patch processing to each service headquarters.
1
20
60
41
21
40
80
61
1
108
144
1
25
26
1
2
4
3
IC603
IC302
S
D
G
Q301
S
D
G
Q302
Q303
BC
E
D301
K
A
8
1
4
5
D201
D304
D302
D101
D303
Q402
E
C
B
Q408
B C E
Q406
B C E
D403
A
K
E C B
Q412
D406
A
K
D441
8
1
4
5
S802
CN604
W401
W402
Q405
8
5
1
4
C439
C445
C821
R416
C438
R452
R442
C437
C414
C415
C416
R455
R454
R417
R423
R435
R426
R433
C435
R465
C434
R431
R470
R405
R404
R410
R406
R464
C433
C429
R811
C810
C430
C428
C451
C427
R422
R480
R436
R434
R425
R457
R456
R482
C452
C446
C405
E C B
Q407
C423
C426
R401
C460
R411
C109
C209
C309
C409
C608
C611
C607
C308
C603
C847
C305
C461
C462
C404
C436
C450
+
C431
+
C432
+
+
C205 +
FB201
FB301
FB101
R111
R211
R209
C206
R204
R205
R212
R614
R620
R606
C602
C601
R601
R615
C883
C831
C832
C838
R814
R820
C837
C875
R623
C833
C834
C803
C835
C836
R894
C845
R613
R604
C899
C610
C841
C843
C842
C844
R612
RB601
C213
C211
C210
R206
R110
R109
C106
R106
C207
R114
R307
R113
R112
C304
R214 R213
R208
R302
R108
C107
R308
R104
R105
C302
C113
C111
C110
R210
CB605
F401
R806
R999
C806
C805
R854
R851
C851
+
E C B
Q411
X601
MAIN BOARD
(CONDUCTOR SIDE)
1-868-466-
(11)
11
IC802
HOLD
r
OFF
HOLD
1
10
DRY BATTERY
SIZE “AA”
(IEC DESIGNATION LR6)
1PC. 1.5V
RECHARGEABLE
BATTERY
NH-7WMAA
1PC. 1.2V 700 mAh
(NE331: 1E18, HK)
1
3
5
4
DC IN 3V
–
+
J401
J301
i
D101, 201, 302 – 304, 441
A
B
C
D
E
F
G
H
I
1
2
3
4
5
6
7
8
9
(NE330: US, CND)
•
Semiconductor
Location
Ref. No. Location
D101
G-3
D201
G-3
D301
I-6
D302
G-3
D303
G-3
D304
G-3
D403
F-3
D406
C-4
D441
C-4
IC301
H-4
IC302
I-6
IC401
C-3
IC603
H-6
IC801
E-7
IC802
D-7
IC851
G-8
Q301
I-6
Q302
I-5
Q303
I-5
Q402
F-3
Q405
D-4
Q406
F-3
Q407
D-4
Q408
F-3
Q411
D-5
Q412
E-3
: Uses unleaded solder.
Содержание D-NE330
Страница 30: ...30 D NE330 NE331 MEMO ...
Страница 41: ...11 D NE330 NE331 MEMO ...