– 9 –
– 10 –
5. PRINTED WIRING BOARD — CD SECTION —
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
b
: Pattern from the side which enables seeing.
• (( ))
: Page of supplement-1
• Semiconductor
Location
CFD-S22/S32
((Page 13))
• Waveforms
(MODE: PLAY)
4
3.2Vp-p
16.9344MHz
IC702
ts
(XOUT)
3
2
1.8V
1
0.9-1.5Vp-p
Approx. 100mVp-p
IC701
w;
(FE)
IC701
wj
(RF)
1.8V
Approx. 100mVp-p
IC701
qk
(TE)
1V/div 0.05
µ
sec/div
500mV/div 0.5
µ
sec/div
100mV/div 20
µ
sec/div
100mV/div 20
µ
sec/div
1
A
B
C
D
E
F
G
H
I
J
2
3
4
5
6
7
8
9
(SLED MOTOR)
(SPINDLE MOTOR)
TAP701
TAP702
04
TP(RF)
D701
C-7
IC701
F-7
IC702
C-5
IC703
I-3
Q701
G-4
Ref. No.
Location