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TABLE OF CONTENTS
1. GENERAL
About Discs ............................................................................. 3
Location of Controls ................................................................ 3
Getting Started ......................................................................... 3
CD ........................................................................................... 4
Video CD/Super VCD ............................................................. 5
Radio ....................................................................................... 6
Other Functions ....................................................................... 6
MP3 File Instruction ................................................................ 7
Connections ............................................................................. 9
2. DISASSEMBLY
2-1. Sub Panel (CD) Assy ......................................................... 10
2-2. CD Mechanism Block ....................................................... 10
2-3. Main Board ....................................................................... 11
2-4. Heat Sink ........................................................................... 11
2-5. Chassis (T) Sub Assy ........................................................ 12
2-6. Lever Section ..................................................................... 12
2-7. Servo Board ....................................................................... 13
2-8. Shaft Roller Assy .............................................................. 13
2-9. Floating Block Assy .......................................................... 14
2-10. Optical Pick-up Block ....................................................... 14
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 15
3-2. Block Diagram –Tuner Section– ....................................... 23
3-3. Block Diagram –CD Section– ........................................... 24
3-4. Block Diagram –MPEG Section– ..................................... 25
3-5. Block Diagram –Display Section– .................................... 26
3-6. Circuit Boards Location .................................................... 26
3-7. Printed Wiring Board –CD Mechanism Section– ............. 28
3-8. Schematic Diagram –CD Mechanism Section (1/3)– ....... 30
3-9. Schematic Diagram –CD Mechanism Section (2/3)– ....... 31
3-10. Schematic Diagram –CD Mechanism Section (3/3)– ....... 32
3-11. Schematic Diagram –Main Section (1/2)– ........................ 33
3-12. Schematic Diagram –Main Section (2/2)– ........................ 34
3-13. Printed Wiring Board –Main Section– .............................. 35
3-14. Schematic Diagram –Relay Section– ................................ 36
3-15. Printed Wiring Board –Relay Section– ............................. 37
3-16. Printed Wiring Board –Display Section– .......................... 38
3-17. Schematic Diagram –Display Section– ............................. 39
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 42
4-2. Front Panel Section ........................................................... 43
4-3. CD Mechanism Section (1) ............................................... 44
4-4. CD Mechanism Section (2) ............................................... 45
4-5. CD Mechanism Section (3) ............................................... 46
5. ELECTRICAL PARTS LIST
........................................ 47
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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