Sony CDX-A360, Руководство по обслуживанию

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3
CDX-A360
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• CD Playback
You can play CD-DA (also containing CD TEXT*), CD-R/CD-
RW (MP3/WMA files also containing Multi Session) and ATRAC
CD (ATRAC3 and ATRAC3plus format).
Type of discs Label on the disc
CD-DA
MP3
WMA
ATRAC CD
* A CD TEXT disc is a CD-DA that includes information such as disc,
artist and track name.
TABLE OF CONTENTS
1. SERVICE NOTE
........................................................ 4
2. GENERAL
Location of Controls and Basic Operations .................... 5
Connections ..................................................................... 5
3. DISASSEMBLY
3-1. Sub Panel Assy ................................................................ 8
3-2. CD Mechanism Block ..................................................... 8
3-3. Main Board ...................................................................... 9
3-4. Chassis (T) Sub Assy ....................................................... 9
3-5. Roller Arm Assy .............................................................. 10
3-6. Chassis (OP) Assy ........................................................... 10
3-7. Optical Pick-up ................................................................ 11
3-8. SL Motor Assy (M902) ................................................... 11
3-9. LE Motor Assy (M903) ................................................... 12
3-10. Servo Board ..................................................................... 12
4. DIAGNOSIS FUNCTION
........................................ 13
5. DIAGRAMS
5-1. Block Diagram –CD Section– ......................................... 15
5-2. Block Diagram –Main Section– ...................................... 16
5-3. Block Diagram –Display Section– .................................. 17
5-4. Circuit Boards Location .................................................. 17
5-5. Printed Wiring Boards –CD Mechanism Section– .......... 19
5-6. Schematic Diagram –CD Mechanism Section (1/2)– ..... 20
5-7. Schematic Diagram –CD Mechanism Section (2/2)– ..... 21
5-8. Printed Wiring Board –Main Section– ............................ 22
5-9. Schematic Diagram –Main Section (1/3)– ...................... 23
5-10. Schematic Diagram –Main Section (2/3)– ...................... 24
5-11. Schematic Diagram –Main Section (3/3)– ...................... 25
5-12. Printed Wiring Boards –Key Section– ............................. 26
5-13. Schematic Diagram –Key Section– ................................. 27
6. EXPLODED VIEWS
6-1. Main Section .................................................................... 34
6-2. Front Panel Section ......................................................... 35
6-3. CD Mechanism Section (1) (MG-611WA-186//Q) ......... 36
6-4. CD Mechanism Section (2) (MG-611WA-186//Q) ......... 37
6-5. CD Mechanism Section (3) (MG-611WA-186//Q) ......... 38
6-6. CD Mechanism Section (4) (MG-611WA-186//Q) ......... 39
7. ELECTRICAL PARTS LIST
.................................. 40