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SMT module de-soldering and rework Guidelines

Module de-soldering and rework _UGD_V1.01 07.12.2009

5 Basic considerations for manual de-soldering

Basic considerations for manual de-soldering:

Immobility: Do not allow the parts to move during solidification of the solder. The end of the

period of solidification of the solder can be observed by a sudden change in the appearance of

the solder surface.

Overheating: The bodies of the components positioned in the stream of gas are often heated

more rapidly than the terminations to be soldered, so that for this reason also overheating

may be encountered.

Removal of excess solder: Removal of solder may be performed at various stages of the repair

operation. Sometimes it is useful to remove as much as possible of the solder before the module is

taken out of or off its place; in other cases the module has already been removed and then excess

solder must be taken off the solder lands before the repaired module or a new one can be replaced

and resoldered.

Содержание SIM300DZ

Страница 1: ...SMT Guidelines Module de soldering and rework_UGD_V1 01...

Страница 2: ...ny information that may be in the customer s possession Furthermore system validation of this product designed by Simcom within a larger electronic system remains the responsibility of the customer or...

Страница 3: ...tory 5 1 Scope of the document 6 2 Manual soldering tools 7 2 1 Manual soldering tools introduction 7 3 Preparation before manual soldering 8 4 Manual de soldering process 9 4 1 PCBA with Single side...

Страница 4: ...OOLS 7 FIGURE 2 CUSTOMIZED SQUARE HOT AIR TIP 7 FIGURE 3 HOLDING IN REVERSE 8 FIGURE 4 DE SOLDERING WITH PREHEATER 9 FIGURE 5 HEATING THE MODULE WITH HOT AIR SOLDERING GUN 10 FIGURE 6 CHECK WHETHER TH...

Страница 5: ...SMT module de soldering and rework Guidelines Module de soldering and rework _UGD_V1 01 07 12 2009 5 Version history Date Version Description of change Author 2008 12 07 01 01 Origin...

Страница 6: ...ng and rework Guidelines Module de soldering and rework _UGD_V1 01 07 12 2009 6 1 Scope of the document This document is intended for the following versions of the SIMCom modules SIM300DZ SIM340DZ SIM...

Страница 7: ...KO 850 Hot air soldering gun 220 300W 50 60Hz 2 Surface thermometer 3 Customized square hot air tip 4 Tweezers 5 Anti Electrostatic discharge wristband 6 Smoke absorber HAKKO 493 7 Repairing board cra...

Страница 8: ...ction The operator should take the anti electrostatic discharge wristband for avoiding damage by static discharge when contact to the components on PCBA z If there are some big size DIP package compon...

Страница 9: ...trate when localized reflow is made with hot air nozzle The illumination of the operation for manual de soldering z Fix the position of the PCBA on the adjustable board cradle z Preheating the PCBA wi...

Страница 10: ...k whether the solder is molten with the tweezee z On the condition of the solder is molten remove the hot air soldering gun reposefully and vertically Care should be taken that the pads of module and...

Страница 11: ...l down in the environmental temperature Assure the module can not be swashed and overturned during the whole process of cooling down Otherwise that may introduce the risk of artificially destruction s...

Страница 12: ...z Overheating The bodies of the components positioned in the stream of gas are often heated more rapidly than the terminations to be soldered so that for this reason also overheating may be encounter...

Страница 13: ...ldering and rework _UGD_V1 01 07 12 2009 13 Contact us Shanghai SIMCom Wireless Solutions Ltd Add Building A SIM Technology Building No 633 Jinzhong Road Changning District Shanghai P R China 200335 T...