
9. Soldering Recommendations
9.1 Soldering Recommendations
The MGM13S is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-
mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid usining more than two reflow cycles.
• A no-clean, type-3 solder paste is recommended.
• A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
• Recommended stencil thickness is 0.100mm (4 mils).
• Refer to the recommended PCB land pattern for an example stencil aperture size.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
MGM13S Mighty Gecko SiP Module Data Sheet
Soldering Recommendations
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