6
Rev 1.9.1 Feb.09
Proprietary and Confidential
73
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
6: Thermal Considerations
This
chapter
describes
the
thermal
characteristics
of
the
module
and
provides
suggestions
for
testing
and
addressing
thermal
issues.
Thermal considerations
Mini
Cards
can
generate
significant
amounts
of
heat
that
must
be
dissipated
in
the
host
device
for
safety
and
performance
reasons.
The
amount
of
thermal
dissipation
required
depends
on
the
following
factors:
•
Supply
voltage
—
Maximum
power
dissipation
for
these
modules
can
be
up
to
3.1
W
at
voltage
supply
limits.
•
Usage
—
Typical
power
dissipation
values
depend
on
the
location
within
the
host,
amount
of
data
transferred,
etc.
Specific
areas
requiring
heat
dissipation
include
the
four
shield
cases
indicated
in
.
•
Transmitter—top
shield
(next
to
RF
connectors).
This
is
likely
to
be
the
hottest
area.
•
Baseband
1—bottom
shield,
below
the
transmitter
•
Receiver—top
shield,
other
side
of
module
from
the
trans
‐
mitter
•
Baseband
2—bottom
shield,
below
the
receiver
You
can
enhance
heat
dissipation
by:
•
Maximizing
airflow
over
/
around
the
module
•
Locating
the
module
away
from
other
hot
components
Note: Adequate dissipation of heat is necessary to ensure that the
module functions properly, and to comply with the thermal require-
ments in PCI Express Mini Card Electromechanical Specification
Revision 1.1.
Module testing
When
testing
your
integration
design:
•
Test
to
your
worst
case
operating
environment
conditions
(temperature
and
voltage)
•
Test
using
worst
case
operation
(transmitter
on
100%
duty
cycle,
maximum
power)
•
Monitor
temperature
at
all
shield
locations.
Attach
thermo
‐
couples
to
each
shield
indicated
below