41110555
Rev 1.0
November 01, 2017
11
Product Technical Specification
Introduction
1.2. Physical Dimensions
AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:
•
Length: 23 mm
•
Width: 22 mm
•
Thickness: 2.5 mm
•
Weight: 2.6 g
Note:
Dimensions specified above are typical values.
1.3. General Features
The table below summarizes the AirPrime HL77xx modules’ features.
Table 2.
General Features
Feature
Description
Physical
•
Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)
•
Metal shield can.
•
RF connection pads (RF main interface)
•
Baseband signals connection
Electrical
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF
HL7718 (Mono-band LTE):
•
LTE B13
HL7748 (Tri-band LTE):
•
LTE B2
•
LTE B4
•
LTE B12
HL7749 (Dual-band LTE):
•
LTE B3
•
LTE B28
SIM interface
•
Only 1.8V support for USIM1
•
SIM extraction / hot plug detection
•
SIM/USIM support
•
Conforms with ETSI UICC Specifications.
•
Supports SIM application tool kit with proactive SIM commands
Application interface
•
NDIS NIC interface support (Windows 7, Windows 8, Linux)
•
MBIM support
•
Multiple non-multiplexed USB channel support
•
Dial-up networking
•
USB selective suspend to maximize power savings
•
CMUX multiplexing over UART
•
AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands
