Module Replacement
2.2.3 Removing a Module
11. Carefully lift and flip the main inner assembly onto the ESD foam pad.
1
2
Figure 2.11 Flipping the Main Inner Assembly
2.2.3
Removing a Module
The process for removing a module varies based on whether or not the module fea-
tures a heat sink.
Removing a Module (With Heatsink)
To remove a module that has a heat sink, do the following:
1. If the module is located on the underside of the main inner assembly, flip the
board.
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RUGGEDCOM RSG2100
Service Manual, 07/2019, C79000-G8976-1151
