Sharp AR-EB7, Руководство по обслуживанию

Страница: 8 / 18

AR-EB7 ELECTRICAL SECTION
– 6 –
[4] ELECTRICAL SECTION
The OA982 board mounted on the IMC2 board inputs and outputs image data to and from the MCU board, controls SDRAM memory, and communi-
cates with USB2.0 devices.
SDRAM memory is used to store programs and image data as well as for a working area.
USB 2.0 devices communicate with a PC through a USB2.0 cable at a rate of 480 Mbps.
SDRAM memory can be expanded by using 1BANK SDRAM DIMM (AR-SM5).
Communications between the OA982 and the AR-SM5 is held using an ASIC-controlled BUFFER IC (74VCX16244/16245).
1. Block diagram
2. Pin arrangement
The table below shows connector pin arrangement between the MCU to IMC2 PWB.
• IMC2 side
Interface-1 CN2 (22FE-BT-VK-N)
Interface-2 CN3 (22FE-BT-VK-N)
IC1
OA982
IC35
BUFFER
ASIC
IC3
256Mbit SDRAM
IC4
256Mbit SDRAM
IC2
8Mbit
FlashROM
IC26 BUFFER
74VCX16245
IC28 BUFFER
74VCX16244
IC29 BUFFER
74VCX16244
IC6
ZeroDelayBuffer
CY2305
CN6 168PIN DIMM SOCKET
(For 1BANK SNR SDRAM DIMM)
X1 XTAL
20.3094MHz
IC8
USB2.0Driver
ISP1581
Y1 XTAL
12.0000MHz
CN2 22pinFFC (T
o MCU)
CN3 22pinFFC (T
o MCU)
USB2.0
Connector
ADDRESS BUS
DATA BUS
CONTROL SIGNAL (/CS,/RAS,/CAS,/WE etc.)
3.3V
Peripheral
BUS(DMA)
8bit ADBUS
USB2.0
High/Full
Speed
Pixel Input BUS (8bit DMA)
Pixel Output BUS (8bit DMA)
SDRAM CLK 81.2376MHz
/OE,/DIR
SDRAM CLK
81.2376MHz
DATA BUS CONTROL BUS ADDRESS BUS
Pin
No.
Signal
name
Processing of
connection
Pattern = “direct”
Pin
No.
Signal
name
Processing of
connection
Pattern = “direct”
1 DGND (MCU
3
IMC) 12 PI_DATA2 MCU
3
IMC
2 ESCMD IMC
3
MCU 13 PI_DATA1 MCU
3
IMC
3 /ESCRDY MCU
3
IMC 14 PI_DATA0 MCU
3
IMC
4 PI_WR MCU
3
IMC 15 /HSYNC MCU
3
IMC
5 PI_ACK MCU
3
IMC 16 /ESPAGE IMC
3
MCU
6 PI_REQ IMC
3
MCU 17 /PRLINE MCU
3
IMC
7 PI_DATA7 MCU
3
IMC 18 /RESET MCU
3
IMC
8 PI_DATA6 MCU
3
IMC 19 3.3V (MCU
3
IMC)
9 PI_DATA5 MCU
3
IMC 20 3.3V (MCU
3
IMC)
10 PI_DATA4 MCU
3
IMC 21 DGND (MCU
3
IMC)
11 PI_DATA3 MCU
3
IMC 22 DGND (MCU
3
IMC)
Pin
No.
Signal
name
Processing of
connection
Pattern = “direct”
Pin
No.
Signal
name
Processing of
connection
Pattern = “direct”
1 DGND (MCU
3
IMC) 12 PO_DATA2 IMC
3
MCU
2 ESSTS MCU
3
IMC 13 PO_DATA1 IMC
3
MCU
3 /ESSRDY IMC
3
MCU 14 PO_DATA0 IMC
3
MCU
4 (PO_CS) NOT USE 15 /READY MCU
3
IMC
5 PO_ACK IMC
3
MCU 16 /SCLINE MCU
3
IMC
6 PO_REQ MCU
3
IMC 17 /ESDET IMC (GND)
3
MCU
7 PO_DATA7 IMC
3
MCU 18 5V (MCU
3
IMC)
8 PO_DATA6 IMC
3
MCU 19 3.3V (MCU
3
IMC)
9 PO_DATA5 IMC
3
MCU 20 3.3V (MCU
3
IMC)
10 PO_DATA4 IMC
3
MCU 21 DGND (MCU
3
IMC)
11 PO_DATA3 IMC
3
MCU 22 DGND (MCU
3
IMC)