
5
Electrical installation
Installation planning taking EMC aspects into account
Operating Instructions – MOVI-C
®
FIELD CONTROLLER standard/advanced
36
5.1.4
Equipotential bonding
Regardless of the PE connection, it is essential that
low-impedance, HF-capable
equipotential bonding
is provided (see also EN 60204-1 or DIN VDE 0100-540):
• Provide for a connection over a wide area between the device and the mounting
plate.
• To do so, use a ground strap (HF litz wire), for example, to connect the device and
the grounding point of the system.
• Do not use the cable shields of data lines for equipotential bonding.
INFORMATION
For detailed information on equipotential bonding for decentralized inverters and
drive units, refer to the publication "Equipotential Bonding of Decentralized Inverters"
by SEW‑EURODRIVE.
MFC1.. design
The following figure shows a connection over a wide surface area between the mount-
ing plate and the device:
[1]
[2]
[3]
[4]
28713959179
[1] Conductive connection over a wide surface between the device and the mounting
plate, in case the entire contact surface is conductive (e.g. unpainted).
[2] Second PE conductor via separate terminals (optional)
[3] PE conductor in the supply system cable
[4] EMC-compliant equipotential bonding, for example using a ground strap (HF litz
wire). The contact surfaces must be conductive (free of paint).
26872137/EN – 12/2021