KISS 2U Short V3 - User Guide, Rev. 1.1
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Thermal Considerations
6.1.
Active Cooling
The KISS 2U Short V3 is forced air-cooled using two internal system fans that force air to flow from the front to the
back of the chassis. The processor and expansion cards have integrated cooling solutions or are equipped with
corresponding cooling devices.
If a filter pad is used, clean the filter pad regularly to ensure that sufficient airflow is provided, see Chapter 10.1:
Cleaning the Filter Pad.
6.2.
Temperature Sensor
The temperature conditions of the product (depending on the environmental temperature and the load) are detected
by two internal temperature sensors (one at the rear and one near the fan assembly) that control the speed of the
system fans within the fan assembly accordingly.
6.3.
Minimum System Clearance
To guarantee that sufficient air flows from the front to the back of the chassis, ensure that the ventilation holes are
not covered, blocked or obstructed by surrounding parts.
Before installing the KISS 2U Short V3 take into account, any thermal considerations mentioned in Chapter 8/:
Installation, such as airflow obstructions and the correct mount orientation.
Ensure Sufficient Airflow
Ensure that the 19” rack cabinet is well ventilated and does not prevent the KISS 2U Short V3
from taking in air at the front and exhausting air at the rear.
Do not place the product close to heat sources or damp places.
There are no ventilation restrictions above and below the product, enabling installation
directly on top of or below another system.
6.4.
Third Party Components
When the KISS 2U Short V3 is extended and configured with third party components such as PCIe expansion cards,
M.2 module, DIMMs and drives (HDD, SSD and DVD), there is an internal temperature rise. Thus, the air temperature
inside the product is higher than the ambient air temperature around the product.
