COMe-bV26 - Rev. 1.0, User Guide
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Table 16: SPI Boot Pin Configuration
BIOS_DIS0#
BIOS_DIS1#
Boot Bus
Function
Open
Open
SPI
Boot on on-module SPI
Open
GND
SPI
Boot on carrier board SPI
The BIOS cannot be split between two chips. Booting takes place either from the module SPI
Flash chip or from the carrier board SPI Flash chip.
Table 17: Supported SPI Boot Flash Types
Size
Manufacturer
Part Number
Package Type
Device ID
16 MByte
Winbond
W25Q128JVSIM
SOIC-8 208-mil
7018h / 17h
For additional safety, a second SPI flash can be populated on the module as an option, see Figure 3: Block Diagram
COMe-bV26. For more information, contact Kontron Support.
3.8.2.
Booting the SPI Flash Chip
Initially, the EFI Shell is booted with an USB key containing the binary used to flash the on-module SPI Flash chip.
T
o
program the external SPI Flash chip on the carrier board with the BIOS binary, use an external programmer.
Register for Kontron’s Customer Section to get access to BIOS downloads and PCN service.
To boot either the carrier board or on-module SPI flash chip, perform the following:
1.
Connect a SPI flash with the correct size (similar to BIOS binary (*.BIN) file size) to the carrier SPI interface.
The external SPI flash chip on the carrier is required to be 16MByte (128 MBit).
2.
Open pin A34 (BIOS_DIS0#) and connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI Flash chip to
boot on carrier
SPI or ground pin A34 (BIOS_DIS0#), and open pin B88 (BIOS_DIS1#) to enable SPI Flash chip to
boot on-module SPI.
The command line is AfuEfix64 bV26RXXX.BIN /p /b /n /k /x /l
command line.
In case of change, check Kontron’s Customer Section for the latest BIOS binary package with
reference command line.00
3.9.
TPM 2.0
The Trusted Platform Module (TPM) 2.0 technology stores RSA encryption keys specific to the host system for
hardware authentication
