SAMSUNG
This Document can not be used without Samsung’s authorization
8-1
Schematic Diagrams
8. Schematic Diagrams
8-1 Main PCB-1
REVISION DESCRIPTION
REV
2009/03/XX
Date
A0
REVISION HISTORY
B-Size H:1.9mm
MCPH3 H:0.85mm
D-Size H:2.8mm
uSOP-8 H:1.0mm
MSOP-10 H: mm
SOD-123 H:1.35mm
A-Size H:1.6mm
SOT-23 H:1.10mm
SOT-23-5 H:0.9~1.3mm
SOC BGA-54 H:1.2mm
LTFBGA-293 H:1.2mm
TQFP-48 H:1.2mm
HC-49US H:3mm
DT-26 H:1.8mm
TSOPII-54 H:1.2mm
TQFP-100 H:1.2mm
EMD3/SOT-416/SC-75A H:0.7mm
UMD3/SOT-323/SC-70 H:0.9mm
Componet limit
SOP-8 H:1.75mm
TEST PAD IS A 40 MIL ROUND PAD
MicroPAK H:0.8mm
A1
A2
B
C
9
8
LCD_AUO(A027DN01)
POWER BLOCK DIAGRAM
7
SYSTEM BLOCK DIAGRAM
6
MAIN to STROBE & UI
5
POWER_AT1868
AUDIO/MIC/AV OUT/CFG
COACH-11S-2
DDR2 SDRAM/NAND/SD CARD
4
TG ADDI9004
Modify Note
3
2
COACH-11S-3/Power I/F
LENS DRIVER
1
COACH-11S-1
Page
COVER PAGE
12
16
15
11
14
10
13
HRS
CCD
33PIN(FPC)
20PIN
MOLEX
STROBE BD
19PIN(FPC)
USB
HRS
TYCO
LENS
45PIN(FPC)
LCD
39PIN(FPC)
HRS
UI
10PIN(FPC)
HRS
STROBE BD
19PIN(FPC)
MOLEX
UI
10PIN(FPC)