Samsung DDR3 Скачать руководство пользователя

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October 2009

General Information

DDR3 SDRAM

DDR3 SDRAM Product Guide

October 2009

Memory Division

Содержание DDR3

Страница 1: ...October 2009 General Information DDR3 SDRAM DDR3 SDRAM Product Guide October 2009 Memory Division ...

Страница 2: ...UNG Memory Interface VDD VDDQ Package Type Temp Power 1 2 3 4 5 6 7 8 9 10 11 Speed B DDR3 SDRAM Commercial Temp 0 C 85 C Normal Power Commercial Temp 0 C 85 C Low Power Commercial Temp 0 C 85 C Low VDD 1 35V FBGA Lead free FBGA Halogen free Lead free FBGA Lead free DDP FBGA Halogen free Lead free DDP 1st Gen 2nd Gen 3rd Gen 4th Gen 5th Gen 6th Gen 7th Gen 8th Gen 9th Gen 11 Speed K 4 B X X X X X ...

Страница 3: ... 4 1 5V 78 ball FBGA Now K4B1G0846F HC L F8 H9 128M x 8 K4B1G0446F HY L F8 H9 256M x 4 1 35V K4B1G0846F HY L F8 H9 128M x 8 2Gb B die 8Banks K4B2G0446B HC L F7 F8 H9 512M x 4 1 5V 78 ball FBGA Now K4B2G0846B HC L F7 F8 H9 256M x 8 K4B2G1646B HC L F7 F8 H9 128M x 16 96 ball FBGA K4B2G0446B HYF7 F8 H9 512M x 4 1 35V 78 ball FBGA K4B2G0846B HYF7 F8 H9 256M x 8 2Gb C die 8Banks K4B2G0446C HC L F8 H9 5...

Страница 4: ... 5V 6 of Banks in comp Interface 3 DDR3 SDRAM Module Ordering Information 1 1st Rev 3 3rd Rev S Reduced Layer C Y Commercial Temp 0 C 85 C Normal Power Commercial Temp 0 C 85 C Low VDD 1 35V Note PC3 6400 DDR3 800 PC3 8500 DDR3 1066 PC3 10600 DDR3 1333 PC3 12800 DDR3 1600 PCB Revision Component Revision of Banks in Comp Interface Depth DRAM Component Type Data bits DIMM Type Memory Module Package ...

Страница 5: ...cs 1Gb D die 8 2 78 4 ball FBGA 30mm Now M391B5673EH1 CF8 H9 K0 128M x 8 18 pcs 1Gb E die 78 ball FBGA M391B5673FH0 CF8 H9 K0 128M x 8 18 pcs 1Gb F die M391B5773CH0 CF8 H9 K0 D 1Rx8 256M x 8 9 pcs 2Gb C die 1 512Mx 64 4GB M378B5273BH1 CF8 H9 B 2Rx8 256M x 8 16 pcs 2Gb B die 8 2 78 ball FBGA 30mm Now M378B5273CH0 CF8 H9 K0 256M x 8 16 pcs 2Gb C die 512Mx 72 4GB M391B5273BH1 CF8 H9 E 2Rx8 256M x 8 1...

Страница 6: ...x8 256M x 8 8 pcs 2Gb C die 8 1 512Mx 64 4GB M471B5273BH1 CF8 H9 F 2Rx8 256M x 8 16 pcs 2Gb B die 8 2 78 ball FBGA 30mm Now M471B5273CH0 CF8 H9 256M x 8 16 pcs 2Gb C die 4 4 204Pin DDR3 SoDIMM 1 35V Product Note 1 35V product is 1 5V operatable 204Pin DDR3 SODIMM Org Density Part Number Speed Raw Card Composition Comp Version Internal Banks Rank PKG Height Avail Note 128Mx 64 1GB M471B2873EH1 YF8 ...

Страница 7: ... 4Rx8 128M x 8 36 pcs 1Gb D die 8 4 78 4 ball FBGA 30mm Now M393B5173EH1 CF7 F8 128M x 8 36 pcs 1Gb E die 4 78 ball FBGA M393B5173FH0 CF7 F8 128M x 8 36 pcs 1Gb F die M393B5170DZ1 CF8 H9 E 2Rx4 256M x 4 36 pcs 1Gb D die 2 78 4 ball FBGA M393B5170EH1 CF8 H9 256M x 4 36 pcs 1Gb E die 2 78 ball FBGA M393B5170FH0 CF8 H9 256M x 4 36 pcs 1Gb F die M393B5273BH1 CF8 H9 B 2Rx8 256M x 8 18 pcs 2Gb B die 2 M...

Страница 8: ...8 H 4Rx8 128M x 8 36 pcs 1Gb E die 8 4 78 ball FBGA 30mm Now M393B5173FH0 YF7 F8 128M x 8 36 pcs 1Gb F die M393B5170EH1 YF8 H9 E 2Rx4 256M x 4 36 pcs 1Gb E die 8 2 M393B5170FH0 YF8 H9 256M x 4 36 pcs 1Gb F die M393B5273BH1 YF8 H9 B 2Rx8 256M x 8 18 pcs 2Gb B die 8 2 M393B5273CH0 YF8 H9 256M x 8 18 pcs 2Gb C die M393B5270BH1 YF8 H9 C 1Rx4 512M x 4 18 pcs 2Gb B die 8 1 M393B5270CH0 YF8 H9 512M x 4 1...

Страница 9: ...FBGA M392B5670EH1 CF8 H9 256M x 4 18 pcs 1Gb E die 78 ball FBGA M392B5670FH0 CF8 H9 256M x 4 18 pcs 1Gb F die M392B5773CH0 CF8 H9 K 1Rx8 128M x 8 9 pcs 1Gb F die 1 78 ball FBGA 512Mx 72 4GB M392B5170DJ1 CF8 H9 N 2Rx4 DDP 512M x 4 18 pcs 1Gb D die 8 2 78 ball FBGA 18 75mm Now M392B5170EM1 CF8 H9 DDP 512M x 4 18 pcs 1Gb E die M392B5170FM0 CF8 H9 DDP 512M x 4 18 pcs 1Gb F die Dec 09 M392B5173FM0 CF7 ...

Страница 10: ...ie 8 1 M392B5670FH0 YF8 H9 256M x 4 18 pcs 1Gb F die M392B5773CH0 YF8 H9 K 1Rx8 512M x 4 9 pcs 2Gb C die 512Mx 72 4GB M392B5170EM1 YF8 H9 N 2Rx4 DDP 512M x 4 18 pcs 1Gb E die 8 2 78 ball FBGA 18 75mm Now M392B5173FM0 YF7 F8 V 4Rx8 256M x 8 18 pcs 1Gb F die 8 4 Dec 09 M392B5170FM0 YF8 H9 N 2Rx4 512M x 4 18 pcs 1Gb F die 8 2 M392B5273BH1 YF8 H9 L 2Rx8 256M x 8 18 pcs 2Gb B die Now M392B5273CH0 YF8 H...

Страница 11: ...dule Label 5 2 Label Example 5 3 RCD Information Example Voltage Vendor Revision Module P N JEDEC Description On Label 1 5V Inphi GS04 B2 M393B5170EH1 CH9 4GB 2Rx4 PC3 10600R 09 10 E1 P0 IDT LV DDR3 B0 M393B5170EH1 CH9 4GB 2Rx4 PC3 10600R 09 10 E1 D2 1 35V Inphi LV GS02 C0 M393B5170EH1 YF8 4GB 2Rx4 PC3L 8500R 07 10 E1 P1 IDT LV DDR3 B0 M393B5170EH1 YF8 4GB 2Rx4 PC3L 8500R 07 10 E1 D2 ...

Страница 12: ...RK B A 11 00 0 10 J K L 0 80 0 80 Post Reflow 0 05 0 05 0 95 1 90 Bottom Top Bottom Top A1 9 00 0 10 11 00 0 10 0 10MAX 0 50 0 05 1 10 0 10 0 35 0 05 A B C D E F G H J L M N P R T 9 00 0 10 4 00 0 80 6 00 Datum B Datum A 10 8 7 6 5 4 3 2 1 11 9 1 60 A1 INDEX MARK 13 30 0 10 K 0 80 x 15 12 00 0 80 x 10 8 00 B A 0 80 0 40 100 0 45 Solder ball 0 2 A B M MOLDING AREA Post Reflow 0 05 0 05 0 95 1 90 A1...

Страница 13: ...1 INDEX MARK B A 11 00 0 10 J K L 0 80 0 80 Post Reflow 0 05 0 05 0 95 1 90 Bottom Top Bottom Top A1 7 50 0 10 11 00 0 10 0 10MAX 0 50 0 05 1 10 0 10 0 35 0 05 A B C D E F G H J L M N P R T 7 50 0 10 6 00 Datum B Datum A A1 INDEX MARK 13 30 0 10 K 0 80 x 15 12 00 B A 0 80 0 40 96 0 45 Solder ball 0 2 A B M MOLDING AREA Post Reflow 0 05 0 05 0 95 1 90 A1 7 50 0 10 13 30 0 10 0 10MAX 0 50 0 05 1 10 ...

Страница 14: ... BOTTOM VIEW 11 50 0 10 J K L 0 80 0 80 Post Reflow 0 50 0 05 0 95 1 90 0 10MAX 1 10 0 10 A1 9 00 0 10 11 50 0 10 0 35 0 05 TOP VIEW A B C D E F G H J L M N P R T 9 00 0 10 3 20 0 80 6 00 Datum B Datum A 1 60 A1 INDEX MARK 13 30 0 10 K 0 80 x 12 12 00 B A 0 80 0 40 96 0 45 Solder ball 0 2 A B M MOLDING AREA Post Reflow 0 50 0 05 0 95 1 90 BOTTOM VIEW 0 10MAX 1 10 0 10 A1 9 00 0 10 13 30 0 10 0 35 ...

Страница 15: ... B Datum A 8 7 6 5 4 3 2 1 9 1 60 A1 INDEX MARK B A 11 00 0 10 J K L 0 80 0 80 Post Reflow 0 50 0 05 0 10MAX 1 40 0 10 A1 10 50 0 10 11 00 0 10 0 35 0 05 A B C D E F G H M N 9 00 0 10 0 80 x 12 9 60 0 80 x 8 6 40 3 20 0 80 4 80 78 0 45 Solder ball 0 2 A B M Datum B Datum A 8 7 6 5 4 3 2 1 9 1 60 A1 INDEX MARK B A 11 50 0 10 J K L 0 80 0 80 Post Reflow 0 50 0 05 0 10MAX 1 40 0 10 A1 9 00 0 10 11 50...

Страница 16: ... Bottom Top A B C D E F G H M N 10 00 0 10 0 80 x 12 9 60 0 80 x 8 6 40 3 20 0 80 4 80 78 0 45 Solder ball 0 2 A B M Datum B Datum A 8 7 6 5 4 3 2 1 9 1 60 A1 INDEX MARK B A 11 50 0 10 J K L 0 80 0 80 Post Reflow 0 50 0 05 0 10MAX 1 40 0 10 A1 10 00 0 10 11 50 0 10 0 35 0 05 ...

Страница 17: ...fered DIMM 133 35 0 15 Max 4 0 54 675 Units Millimeters 9 50 128 95 2 4X 3 00 0 1 30 00 0 15 2 30 17 30 A B 47 00 71 00 2 50 1 00 0 2 0 15 2 50 0 20 Detail B 5 00 Detail A 1 50 0 10 0 80 0 05 3 80 2x 2 10 0 15 2 50 SPD N A for x72 for x64 ECC 1 270 0 10 N A for x64 for x72 ECC ...

Страница 18: ...DRAM Unbuffered SODIMM 0 25 MAX 2 55 Detail B Detail A 1 00 0 10 0 45 0 03 4 00 0 10 67 60 SPD 0 10 A B M C 2X 4 00 0 10 0 10 A B M C 2X 1 80 OPTIONAL HOLES 0 60 Units Millimeters 21 00 24 80 63 60 39 00 A B 1 65 6 30 00 0 15 20 00 Max 3 8 1 00 0 10 0 10 A B M C ...

Страница 19: ...nd and Control lines A B 47 00 71 00 Units Millimeters 9 50 128 95 2X 3 00 17 30 Register 1 00 0 2 0 15 2 50 0 20 Detail B 5 00 Detail A 1 50 0 10 0 80 0 05 3 80 2 50 9 76 18 92 32 40 18 93 9 74 10 9 C Detail C 10 9 R 0 5 0 0 4 2x 2 10 0 15 2 30 1 27 0 10 1 0 max 133 35 0 15 2 50 30 00 0 15 Max 4 0 54 675 ...

Страница 20: ...15 25 6 0 15 7 45 119 29 80 78 Green Line TIM Attatch Line 0 4 1 0 0 3 0 65 0 2 R0 2 R 0 1 1 25 6 0 15 0 15 1 3 1 3 2 2 0 1 2 6 0 2 1 FRONT PART Reg pedestal line Outside Inside Green Line TIM Attatch Line Outside Inside 2 BACK PART 29 77 31 4 11 9 9 26 128 5 Registered DIMM Heat Spreader Design ...

Страница 21: ...0 3 Upper Bending Tilting Gap 0 5 3 CLIP PART C 1 05 132 95 133 45 1 27 4 DDR3 RDIMM ASS Y View Reference thickness total Maximum Mono Package 7 55mm DDP Package 7 71mm With Clip thickness Dimension Index Mono DDP Note Min Typ Max Min Typ Max A 43 9 44 4 B 6 7 6 8 6 9 7 2 7 3 7 4 C 5 8 6 3 D 6 7 6 8 6 9 7 2 7 3 7 4 E Clip open size 2 5 3 6 2 6 3 8 ...

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