RF-BM-BG22A3(I)
Shenzhen RF-star Technology Co., Ltd.
Page 21 of 26
metal shell.
4.
The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5.
The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6.
The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
5.6.2 Vulnerable Module
1.
Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2.
Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3.
Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
5.6.3 High Bit Error Rate
1.
There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2.
The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3.
If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
5.7 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1.
According to the anti-static measures, bare hands are not allowed to touch modules.
2.
Modules must be placed in anti-static areas.
3.
Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
5.8 Soldering and Reflow Condition
1.
Heating method: Conventional Convection or IR/convection.
2.
Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3.
Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4.
Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5.
Peak temperature: 245
℃
.
