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4.12.5. Audio Signal Design Considerations

For handheld handset and hands-free microphone, it is recommended to use the electret microphone with

dual built-in capacitors (e.g. 10 pF and 33 pF) for filtering out RF interference, thus reducing coupling TDD

noise. The 33 pF capacitor is applied for filtering out high-frequency interference when the module is

transmitting at EGSM900. Without this capacitor, TDD noise could be heard during voice calls. The 10 pF

capacitor here is used for filtering out high-frequency interference at DCS1800. Note that the resonant

frequency point of a capacitor largely depends on its material and production technique. Therefore, you

would have to discuss with vendors of the capacitor to choose the most suitable capacitor for filtering out

high-frequency noises during operation.

The severity degree of the high-frequency interference in the voice channel during GSM transmitting

largely depends on the application design. In some cases, EGSM900 TDD noise is severer; while in other

cases, DCS1800 TDD noise is more obvious. Therefore, a suitable capacitor should be selected based

on the test results. Sometimes, no RF filtering capacitor is required.

In order to decrease radio or other signal interference, RF antennas should be placed away from audio

components and audio traces. Additionally, keep power traces far away from the audio traces and do not

route them in parallel.

The differential audio traces must be routed according to the differential signal layout rule.

4.13. USB_BOOT Interface

Table 25: Pin Definition of USB_BOOT Interface

USB_BOOT is a download interface. Drive USB_BOOT down to the GND before turning on the module,

the module can enter into download mode when turned on. Then you can upgarde the firmware through

USB1.

Pin Name

Pin No.

I/O

Description

Comment

USB_BOOT

Force the module into

download mode

Before turning on the module,

driving USB_BOOT down to GND

can enable module to enter into

download mode after turn-on.

A TVS component should be

reserved between the module and

interface for ESD protection.

Содержание SC200K Series

Страница 1: ...SC200K Series Hardware Design Smart Module Series Version 1 0 Date 2022 02 21 Status Released...

Страница 2: ...we employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as availa...

Страница 3: ...To implement module functionality certain device data are uploaded to Quectel s or third party s servers including carriers chipset suppliers or customer designated servers Quectel strictly abiding by...

Страница 4: ...interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles...

Страница 5: ...SC200K_Series_Hardware_Design 4 105 About the Document Revision History Version Date Author Description 2022 01 05 Kevin SU Jerry WANG Creation of the document 1 0 2022 02 21 Kevin SU Jerry WANG Firs...

Страница 6: ...tery Charge and Management 33 3 1 3 Reference Design for Power Supply 35 3 1 4 Voltage Stability Requirements 35 3 2 Turn On 37 3 2 1 Turn On Module with PWRKEY 37 3 2 2 Turn On Module Automatically T...

Страница 7: ...73 5 2 Cellular Network 74 5 2 1 Antenna Interfaces Frequency Bands 74 5 2 2 Tx Power 75 5 2 3 Rx Sensitivity 75 5 2 4 Reference Design 76 5 3 Wi Fi Bluetooth 77 5 3 1 Antenna Interface Frequency Band...

Страница 8: ...Smart Module Series SC200K_Series_Hardware_Design 7 105 8 3 Packaging Specifications 98 8 3 1 Carrier Tape 98 8 3 2 Plastic Reel 99 8 3 3 Packaging Process 100 9 Appendix References 101...

Страница 9: ...ace 54 Table 19 Pin Definition of LCM Interface 55 Table 20 Pin Definition of Touch Panel Interface 57 Table 21 Pin Definition of Camera Interfaces 58 Table 22 MIPI Trace Length Inside Module 63 Table...

Страница 10: ...ischarge Characteristics Temperature 25 C Humidity 45 90 Table 44 Operating and Storage Temperatures 91 Table 45 Recommended Thermal Profile Parameters 98 Table 46 Carrier Tape Dimension Table Unit mm...

Страница 11: ...uit Design for LCM Interface 56 Figure 22 Reference Cicuit for LCM External Backlight Driver 57 Figure 23 Reference Circuit Design for Touch Panel Interface 58 Figure 24 Reference Circuit Design for D...

Страница 12: ...Figure 44 Module Bottom Dimensions Unit mm 93 Figure 45 Recommended Footprint Top View 94 Figure 46 Top Bottom Views of Module 95 Figure 47 Recommended Reflow Soldering Thermal Profile 97 Figure 48 C...

Страница 13: ...erfaces and hardware interfaces which relate to customers applications It can help you quickly understand interface specifications electrical and mechanical details as well as other related informatio...

Страница 14: ...ct with a size of only 40 5 mm 40 5 mm 2 85 mm With these the module is engineered to meet the demanding requirements in M2M applications such as POS on board computers multimedia terminals smart home...

Страница 15: ...PU Up to 1 6 GHz 32 KB L1 I cache 32 KB L1 D cache 128 KB L2 cache 512 KB L3 cache GPU GE8322 GPU working frequency 550 MHz Memory SC200K CE 16 GB eMMC 2 GB LPDDR4X default 32 GB eMMC 2 GB LPDDR4X 64...

Страница 16: ...nd coding methods Downlink coding schemes MCS 1 9 Uplink coding schemes MCS 1 9 Max 296 kbps DL 236 8 kbps UL SMS Text and PDU modes Point to point MO and MT SMS cell broadcast SMS storage ME by defau...

Страница 17: ...Mbps Supports USB OTG supports host and device modes supports Type C USB hub expansion is not supported Used for AT command communication data transmission software debugging firmware upgrade USB2 Co...

Страница 18: ...PIOs I2C SD 3 0 UART 2 U SIM USB1 2 CSI TP LCM EAR SPK MICs ADC BBCLK MEM Multimedia Connectivity Air Interface Processors Codec Power Signal Power Function SAW Duplex PA SWITCH SAW LNA SAW Switch SAW...

Страница 19: ...ART Pins GPIO Pins ANT Pins TP Pins LCM Pins Camera Pins Other Pins RESERVED Pins SD Card Pins 254 VBAT_BB VBAT_BB GND MIC1_P MIC1_M MIC2_P GND EAR_P EAR_M SPK_P SPK_M GND USB1_DM USB1_DP GND USB_ID U...

Страница 20: ...tput OD Open Drain PI Power Input PO Power Output PIO Power Input Output Power Supply Pin Name Pin No I O Description DC Characteristics Comment VBAT_BB 1 2 PIO Power supply for the module s baseband...

Страница 21: ...open VDDCAMD 152 192 PO 1 2 V output Power supply for camera DVDD Vnom 1 20 V IOmax 400 mA A bypass capacitor should be added when using the pin For more details see document 1 When using dual camera...

Страница 22: ...SPK_P 10 AO Loudspeaker output SPK_M 11 AO Loudspeaker output HPH_R 136 AO Headphone right channel output HPH_GND 137 AO Headphone reference ground If unused needs to be grounded HPH_L 138 AO Headphon...

Страница 23: ...cs Comment USB_VBUS 141 142 PI Charging power input USB insertion detection Vmax 9 20 V Vmin 4 50 V Vnom 5 00 V Used for USB 5 V power input USB1_DM 13 AIO USB1 2 0 differential data USB 2 0 compliant...

Страница 24: ...U SIM2 card data VILmax 0 3 USIM2_VDD VIHmin 0 7 USIM2_VDD VOLmax 0 1 USIM2_VDD VOHmin 0 9 USIM2_VDD USIM2_CLK 19 DO U SIM2 card clock VOLmax 0 1 USIM2_VDD VOHmin 0 9 USIM2_VDD USIM2_RST 18 DO U SIM2...

Страница 25: ...D VOHmin 0 9 USIM1_VDD USIM1_DET 22 DI U SIM1 card hot plug detect VILmax 0 48 V VIHmin 1 39 V Active low If unused keep it open Disabled by software by default UART Interfaces Pin Name Pin No I O Des...

Страница 26: ...an LDO with output current of 1 A if an external large capacity SD card is needed VDDSDIO 32 PO Power supply for SDIO pull up circuit Vnom 3 0 V IOmax 100 mA Only for SD_DATA and SD_CMD pull up circui...

Страница 27: ...Pin Name Pin No I O Description DC Characteristics Comment PWM 29 DO PWM output VOLmax 0 20 V VOHmin 1 46 V 1 85 V power domain LCD_RST 49 DO LCD reset LCD_TE 50 DI LCD tearing effect VILmax 0 48 V V...

Страница 28: ...IPI lane 2 data of CSI0 camera CSI0_LN2_P 73 AI MIPI lane 2 data of CSI0 camera CSI0_CLK1_N 257 AI MIPI clock 1 of CSI0 camera CSI0_CLK1_P 232 AI MIPI clock 1 of CSI0 camera CSI1_CLK_N 157 AI MIPI clo...

Страница 29: ...in DCAM_RST 164 DO Reset of camera DCAM_PWDN 163 DO Power down of camera DCAM_I2C_SCL 166 OD I2C clock of camera 1 85 V power domain Integrates 1 8 20 k configurable pull up resistors DCAM_I2C_SDA 205...

Страница 30: ...esistor CS_M 183 AI Battery current detect If fuel gauge is not used connect these pins to the ground Supports up to 3 A current measurement CS_P 184 AI Battery current detect Antenna Interfaces Pin N...

Страница 31: ...ral purpose input output GPIO_154 97 DIO General purpose input output GPIO_155 98 DIO General purpose input output GPIO_38 168 DIO General purpose input output GPIO_39 167 DIO General purpose input ou...

Страница 32: ..._90 123 DIO General purpose input output GPIO_91 112 DIO General purpose input output GPIO_92 113 DIO General purpose input output GPIO_93 124 DIO General purpose input output GPIO_94 115 DIO General...

Страница 33: ...a USB data cable an earphone antennas and other peripherals to control or to test the module For more details see document 3 GPIO_25 260 DIO General purpose input output GPIO_26 262 DIO General purpo...

Страница 34: ...e charging current is 70 mA When the battery voltage ranges between 2 05 V and 3 05 V the charing current is 450 mA Constant current charging mode CC mode When the battery voltage is increased to 3 05...

Страница 35: ...ies When different batteries are utilized the charging and discharging curves in software must be modified correspondingly to achieve the best performance If the thermistor is not available in the bat...

Страница 36: ...PVIN PVIN EN SS TR PGND PGND VCC_5 V C6 3 3 nF R3 51K Q1 R2 47K R1 4 7K C2 10 F C1 470 F C3 100 nF D1 3V8_EN Figure 4 Reference Design of Power Supply 3 1 4 Voltage Stability Requirements The recomme...

Страница 37: ...there will be no too large voltage drop under high current at the maximum transmission power The width of VBAT trace should be no less than 3 mm In principle the longer the VBAT trace is the wider it...

Страница 38: ...s illustrated in the following figure Turn on pulse PWRKEY 4 7K 47K 2 5 s R1 R2 Q1 R3 1K Figure 7 Turn On Module with Open Collector Driver Another way to control the PWRKEY is by using a button direc...

Страница 39: ...matically Through CBL_PWR_N Table 8 Pin Definition of CBL_PWR_N Interface 1 Make sure that VBAT is stable before pulling down the PWRKEY pin It is recommended to drive PWRKEY low after VBAT reaches 3...

Страница 40: ...anually In such case it can be turned off only by cutting off the power supply of system 3 3 Turn Off The module can be turned off by driving PWRKEY low for at least 1 s Then the module will detect a...

Страница 41: ...hronize time through the network after being powered on The input voltage range of VBAT_BK is 2 0 V to 3 25 V The typical value is 3 0 V If a rechargeable button battery is used ESR of the battery sho...

Страница 42: ...Smart Module Series SC200K_Series_Hardware_Design 41 105 VDD28 2 8 150 Keeps ON VDDCAMD 1 2 400 VDDCAMA 2 8 150 VDDSD 3 0 400 VDDSDIO 3 0 100 USIM1_VDD 1 8 2 95 50 USIM2_VDD 1 8 2 95 50...

Страница 43: ...on with transmission rate up to 100 Mbps Supports host mode only Supports USB hub expansion Table 10 Pin Definition of USB Interfaces Pin Name Pin No I O Description Comment USB_VBUS 141 142 PI Chargi...

Страница 44: ...USB1_DM USB_VBUS AW3605DNR SW VIN 22 F C2 10 F 10K 1 0 H VBAT C1 L1 R1 EN AGND VOUT VOUT NC PGND PGND 1 2 9 4 5 6 7 8 VBUS VBAT GPIO_XX 3 GND 100 nF C1 D1 D2 D3 ESD ESD ESD D4 D5 ESD ESD Figure 13 Ref...

Страница 45: ...VIN EN 4 5 1 VOUT VOUT 7 8 NC 6 C2 22 F C3 10 F R1 10K VBAT GPIO_XX AGND PGND PGND 2 3 9 Figure 14 Reference Design of USB1 Micro Interface USB2_DP USB2_DM 1 2 3 5 USB_DP USB_DM VBUS GND GND GND GND G...

Страница 46: ...aces in inner layer and surround the traces with ground on that layer and with ground planes above and below Layout routing requirements keep differential signal traces of USB 2 0 of the same length a...

Страница 47: ...F C2 U1 100 pF Figure 16 Reference Circuit of Level Translator Chip For UART0 When the module communicates with PC level translation is also required A level translator chip and an RS 232 translator c...

Страница 48: ...faces meet ETSI and IMT 2000 requirements Either 1 8 V or 2 95 V U SIM card is supported Dual SIM Dual Standby is supported by software by default Table 13 Pin Definition of U SIM Interfaces UART2 and...

Страница 49: ...n U SIM Card Connector If U SIM card detect function is not needed you can keep USIM_DET unconnected A reference circuit for U SIM card interfaces with a 6 pin U SIM card connector is illustrated in t...

Страница 50: ...xceed 1 F Additionally place the capacitor near the U SIM card connector To avoid cross talk between USIM_DATA and USIM_CLK keep them away from each other and shield them with surrounded ground In ord...

Страница 51: ...pF 4 7 F VDDSDIO Module R1 R2 R3 R4 R5 R6 NM_51K NM_10K NM_51K NM_51K R7 R8 R9 R10 R11 R12 R13 D1 D2 D3 D4 D5 D6 D7 D8 C1 C2 SD Card Connector Figure 20 Reference Circuit for SD Card Interface Pin Nam...

Страница 52: ...to route these traces on the inner layer of PCB and keep them of the same length Additionally SD_CLK needs separate ground shielding Trace length requirements Control impedance as 50 10 and add groun...

Страница 53: ...Characteristic Description GPIO_122 99 DIO VILmax 0 48 V VIHmin 1 39 V VOLmax 0 20 V VOHmin 1 46 V General purpose input output GPIO_156 100 DIO GPIO_154 97 DIO GPIO_155 98 DIO GPIO_38 168 DIO GPIO_39...

Страница 54: ...O GPIO_16 178 DIO GPIO_15 179 DIO GPIO_25 260 DIO GPIO_26 262 DIO 1 For details of GPIO configuration see document 2 2 For external inputs with hardware mechanical jitter such as keypad etc select GPI...

Страница 55: ...ce Pin Name Pin No I O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor 1 85 V power domain Integrates 1 8 20 k configurable pull up resistors Only used for external sensor SENSO...

Страница 56: ...is shown below Table 19 Pin Definition of LCM Interface Pin Name Pin No I O Description Comment PWM 29 DO PWM output 1 85 V power domain LCD_RST 49 DO LCD reset LCD_TE 50 DI LCD tearing effect DSI_CL...

Страница 57: ...32 33 34 DSI C4 100 nF GND Figure 21 Reference Circuit Design for LCM Interface MIPI are high speed signal lines It is recommended to add common mode filter in series near the LCM connector to reduce...

Страница 58: ...and provides the corresponding power supply and interrupt pins The pin definition of touch panel interface is illustrated below Table 20 Pin Definition of Touch Panel Interface Pin Name Pin No I O Des...

Страница 59: ...rts two cameras 4 lane 4 lane or three cameras 4 lane 2 lane 1 lane The maximum data rate is up to 1 5 Gbps lane The maximum pixel of the camera is up to 16 MP The video quality and photo quality are...

Страница 60: ...SI1 camera CSI1_LN0_N 158 AI MIPI lane 0 data of CSI1 camera CSI1_LN0_P 197 AI MIPI lane 0 data of CSI1 camera CSI1_LN1_N 159 AI MIPI lane 1 data of CSI1 camera CSI1_LN1_P 198 AI MIPI lane 1 data of C...

Страница 61: ...figurable pull up resistors CAM_I2C_SDA 84 OD I2C data of camera DCAM_MCLK 165 DO Clock of camera 1 85 V power domain DCAM_RST 164 DO Reset of camera DCAM_PWDN 163 DO Power down of camera DCAM_I2C_SCL...

Страница 62: ...CLK_P CSI1_CLK_N 1 F 4 7 F 4 7 F EMI EMI EMI CSI1_LN2_P CSI1_LN2_N CSI1_LN3_P CSI1_LN3_N SCAM_PWDN SCAM_MCLK DCAM_I2C_SDA DCAM_I2C_SCL VDDCAMIO SCAM_RST EMI EMI AVDD AF_VDD DVDD DOVDD 1 F CSI0_CLK0_P...

Страница 63: ...SCAM_MCLK CSI0_LN2_P CSI0_LN2_N CSI0_CLK1_P CSI0_CLK1_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N CSI1_CLK_P CSI1_CLK_N CSI0_CLK0_P CSI0_CLK0_N VDDCAMIO VDDCAMA NM NM Camera 0 connector 1 0 F MCAM_R...

Страница 64: ...recommended among MIPI signal lines During impedance matching do not connect GND on different planes so as to ensure impedance consistency It is recommended to select a low capacitance TVS component...

Страница 65: ...2 CSI0_LN2_N 24 78 0 49 73 CSI0_LN2_P 25 27 70 CSI0_LN3_N 24 77 0 49 71 CSI0_LN3_P 25 26 257 CSI0_CLK1_N 14 83 0 54 232 CSI0_CLK1_P 14 29 157 CSI1_CLK_N 25 84 0 3 196 CSI1_CLK_P 26 14 158 CSI1_LN0_N 1...

Страница 66: ...audio interfaces Table 24 Pin Definition of Audio Interfaces Pin Name Pin No I O Description Comment SENSOR_I2C_SCL 91 OD External sensor I2C clock 1 85 V power domain Integrates 1 8 20 k configurabl...

Страница 67: ...phone interface features stereo left and right channel output and supports headphone insertion detection The 3 microphone inputs of the module are all integrated with a bias voltage inside the module...

Страница 68: ...MIC3_P 1 2 F1 D2 MIC_P MIC_N NM C2 D1 F2 NM R5 GND C1 NM Figure 27 Reference Circuit Design for Auxiliary Microphone 4 12 2 Reference Design for Earpiece Interface EAR_P EAR_M R2 33 pF 33 pF 100 pF C...

Страница 69: ...HPH_GND 33 pF Module 3 6 4 5 2 1 33 pF 33 pF C3 C4 C5 F3 F2 F1 D1 D2 D3 D4 F4 R2 R3 0R Figure 29 Reference Circuit Design for Headset Interface 4 12 4 Reference Circuit Design for Loudspeaker Interfac...

Страница 70: ...smitting largely depends on the application design In some cases EGSM900 TDD noise is severer while in other cases DCS1800 TDD noise is more obvious Therefore a suitable capacitor should be selected b...

Страница 71: ...Series SC200K_Series_Hardware_Design 70 105 S1 Module USB_BOOT R1 1K GND Figure 31 Reference Circuit Design for Download Interface The firmware upgrade of the module must be realized by driving USB_BO...

Страница 72: ...he module has been significantly improved 5 1 1 Antenna Interface Frequency Bands Table 26 Pin Definition of GNSS Antenna Interface Table 27 Operating Frequency 5 1 2 GNSS Performance Table 28 GNSS Pe...

Страница 73: ...the minimum GNSS signal power at which the module can maintain lock keep positioning for at least 3 minutes continuously 2 Reacquisition sensitivity the minimum GNSS signal power required for the mod...

Страница 74: ...duced positioning accuracy In order to avoid this please follow the reference design rules as below Maximize the distance between the GNSS antenna and the GPRS RF part including trace routing and ante...

Страница 75: ...face 50 impedance ANT_DRX 131 AI Diversity antenna interface 3GPP bands Transmit MHz Receive MHz EGSM900 880 915 925 960 DCS1800 1710 1785 1805 1880 WCDMA B1 1920 1980 2110 2170 WCDMA B8 880 915 925 9...

Страница 76: ...B1 23 dBm 2 dB 39 dBm LTE FDD B3 23 dBm 2 dB 39 dBm LTE FDD B5 23 dBm 2 dB 39 dBm LTE FDD B8 23 dBm 2 dB 39 dBm LTE TDD B34 23 dBm 2 dB 39 dBm LTE TDD B38 23 dBm 2 dB 39 dBm LTE TDD B39 23 dBm 2 dB 3...

Страница 77: ...e placed as close to the antenna as possible The capacitors are not mounted by default 0 is mounted on R1 and R2 DCS1800 108 102 4 WCDMA B1 110 110 111 106 7 WCDMA B8 110 110 111 103 7 LTE FDD B1 10 M...

Страница 78: ...ace should be controlled to 50 You can connect external antennas such as PCB antenna sucker antenna and ceramic antenna to the module via the interface to achieve Wi Fi and Bluetooth functions The fol...

Страница 79: ...yption Supports AP and STA modes Supports Wi Fi Direct Supports MCS 0 7 for HT20 and HT40 Supports MCS 0 8 for VHT20 Supports MCS 0 9 for VHT40 and VHT80 5 3 2 1 Wi Fi performance The following tables...

Страница 80: ...HT40 MCS7 13 dBm 2 5 dB 802 11ac VHT20 MCS0 14 dBm 2 5 dB 802 11ac VHT20 MCS8 13 dBm 2 5 dB 802 11ac VHT40 MCS0 13 dBm 2 5 dB 802 11ac VHT40 MCS9 12 dBm 2 5 dB 802 11ac VHT80 MCS0 12 dBm 2 5 dB 802 1...

Страница 81: ...mmodate 79 channels The BLE channel bandwidth is 2 MHz and can accommodate 40 channels Table 37 Bluetooth Data Rate and Version Referenced specifications are listed below 802 11n HT20 MCS7 69 dBm 802...

Страница 82: ...mance Table 38 Bluetooth Transmitting and Receiving Performance 5 3 4 Reference Design A reference circuit design for Wi Fi Bluetooth antenna interface is shown as below Capacitors are not mounted by...

Страница 83: ...height from the reference ground to the signal layer H and the spacing between RF traces and grounds S Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impeda...

Страница 84: ...be fully connected to ground The distance between the RF pins and the RF connector should be as short as possible and all the right angle traces should be changed to curved ones The recommended trace...

Страница 85: ...linear VSWR 2 Typ Passive antenna gain 0 dBi Active antenna noise figure 1 5 dB Typ Active antenna gain 2 dBi Active antenna embedded LNA gain 17 dB Typ Active antenna overall LNA gain 17 dBi Typ GSM...

Страница 86: ...connector is used for antenna connection it is recommended to use U FL R SMT connector provided by Hirose Figure 40 Dimensions of U FL R SMT Connector Unit mm U FL LP serial connectors listed in the f...

Страница 87: ...eries SC200K_Series_Hardware_Design 86 105 The following figure describes the space factor of mated connector Figure 42 Space Factor of Mated Connector Unit mm Please visit http www hirose com for mor...

Страница 88: ...Absolute Maximum Ratings 6 2 Power Supply Ratings Table 41 Module Power Supply Ratings Parameter Min Max Unit VBAT 0 3 6 0 V USB_VBUS 0 3 16 0 V Peak Current of VBAT 3 0 A Voltage on Digital Pins 0 3...

Страница 89: ...A Sleep state USB disconnected DRX 9 3 8 mA WCDMA supply current Sleep state USB disconnected DRX 6 5 5 mA Sleep state USB disconnected DRX 7 4 5 mA Sleep state USB disconnected DRX 8 4 0 mA Sleep sta...

Страница 90: ...power 660 mA GPRS data transmission EGSM900 1UL 4DL PCL 5 310 mA EGSM900 2UL 3DL PCL 5 490 mA EGSM900 3UL 2DL PCL 5 600 mA EGSM900 4UL 1DL PCL 5 650 mA DCS1800 1UL 4DL PCL 0 240 mA DCS1800 2UL 3DL PCL...

Страница 91: ...n The following table shows the module s electrostatic discharge characteristics Table 43 Electrostatics Discharge Characteristics Temperature 25 C Humidity 45 DCS1800 4UL 1DL PCL 2 500 mA WCDMA data...

Страница 92: ...emperatures Table 44 Operating and Storage Temperatures 2 Within operating temperature range the module meets 3GPP specifications Antenna Interfaces 5 10 kV Other Interfaces 0 5 1 kV Parameter Min Typ...

Страница 93: ...al Information This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unless otherwise specified 7 1 Mech...

Страница 94: ...Smart Module Series SC200K_Series_Hardware_Design 93 105 Figure 44 Module Bottom Dimensions Unit mm The package warpage level of the module conforms to the JEITA ED 7306 standard NOTE...

Страница 95: ...other components on the motherboard to improve soldering quality and maintenance convenience 2 The size of the four GND pads in the center of the module is larger than 2 2 mm and therefore each GND pa...

Страница 96: ...Design 95 105 7 3 Top and Bottom Views Figure 46 Top Bottom Views of Module Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label refe...

Страница 97: ...han 10 e g a drying cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Stor...

Страница 98: ...other side of PCB has been completed The recommended reflow soldering thermal profile lead free reflow soldering and related parameters are shown below Temp C Reflow Zone Soak Zone 246 200 217 235 C...

Страница 99: ...ure 235 246 C Cooling down slope 1 5 to 3 C s Reflow Cycle Max reflow cycle 1 1 If a conformal coating is necessary for the module do NOT use any coating material that may chemically react with the PC...

Страница 100: ...48 Carrier Tape Dimension Drawing Table 46 Carrier Tape Dimension Table Unit mm 8 3 2 Plastic Reel Figure 49 Plastic Reel Dimension Drawing Table 47 Plastic Reel Dimension Table Unit mm W P T A0 B0 K0...

Страница 101: ...wind the heat sealed carrier tape to the plastic reel and use the protective tape for protection 1 plastic reel can load 200 modules Place the packaged plastic reel humidity indicator card and desicc...

Страница 102: ...Quectel_Smart_EVB_G5_User_Guide 4 Quectel_RF_Layout_Application_Note 5 Quectel_Module_Secondary_SMT_Application_Note Abbreviations Description 3GPP 3rd Generation Partnership Project ADC Analog to Dig...

Страница 103: ...dded Multimedia Card eSCO Extended Synchronous Connection Oriented ESD Electrostatic Discharge ESR Equivalent Series Resistance FDD Frequency Division Duplex FR Full Rate GMSK Gaussian Minimum Shift K...

Страница 104: ...or LE Low Energy LGA Land Grid Array LNA Low Noise Amplifier LTE Long Term Evolution Mbps Megabits per second MCS Modulation and Coding Scheme MIC Microphone MIMO Multi Input Multi Output Multiple Inp...

Страница 105: ...ital Card SMS Short Message Service STA Station TDD Time Division Duplex TP Touch Panel TXD Transmit Data Pin TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver Transmitter UMTS Uni...

Страница 106: ...K_Series_Hardware_Design 105 105 VOHmin Minimum High level Output Voltage VOLmax Maximum Low level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wir...

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