M50 Hardware Design
M50_HD_V2.0
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7. Storage and manufacturing
7.1. Storage
M50 is distributed in vacuum-sealed bag. The restriction of storage condition is shown as below.
Shelf life in sealed bag: 12 months at <40
℃
/90% RH
After this bag is opened, devices that will be subjected to reflow solder or other high temperature
process must be:
Mounted within 72 hours at factory conditions of
≤30
℃
/60% RH
Stored at <10% RH
Devices require bake before mounting, if:
Humidity indicator card is >10% when read at 23
℃
±5
℃
Mounted exceed 72 hours at factory conditions of
≤30
℃
/60% RH
If baking is required, devices may be baked for 48 hours at 125
℃
±5
℃
Note: As plastic container cannot be subjected to high temperature, devices must be removed
prior to high temperature (125
℃
) bake. If shorter bake times are desired, refer to the
IPC/JEDECJ-STD-033 for bake procedure.
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