LTE Module Series
EG95 Hardware Design
EG95_Hardware_Design 66 / 81
6.8.
Thermal Consideration
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
On customers’ PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply, etc.
Do not place components on the opposite side of the PCB area where the module is mounted, in
order to facilitate adding of heatsink when necessary.
Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as
to ensure better heat dissipation performance.
The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
Make sure the ground pads of the module and PCB are fully connected.
According to customers’ application demands, the heatsink can be mounted on the top of the module,
or the opposite side of the PCB area where the module is mounted, or both of them.
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The size of the heatsink should be larger than that of the module’s shielding cover to avoid the
deformation of the shielding cover.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG95 Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
