Quectel EG25-GL, Проектирование аппаратного обеспечения

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LTE Standard Module Series
EG25-GL_Hardware_Design 86 / 96
8
Storage, Manufacturing and
Packaging
8.1 Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity
should be 35
–60 %.
2. Shelf life (in a vacuum-sealed packaging): 12 months in Recommended Storage Condition.
3. Floor life: 168 hours
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in a factory where the temperature is 23 ±5 °C and relative humidity is below
60 %. After the vacuum-sealed packaging is removed, the module must be processed in reflow
soldering or other high-temperature operations within 168 hours. Otherwise, the module should be
stored in an environment where the relative humidity is less than 10 % (e.g., a dry cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫
The module is not stored in Recommended Storage Condition;
⚫
Violation of the third requirement mentioned above;
⚫
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫
Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
⚫
The module should be baked for 8 hours at 120 ±5 °C;
⚫
The module must be soldered to PCB within 24 hours after the baking, otherwise it should be put
in a dry environment such as in a dry cabinet.
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This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033 . It is recommended to start the
solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or
are not sure to conform to
IPC/JEDEC J-STD-033 . And do not remove the packages of tremendous modules if they are not
ready for soldering.