LTE Standard Module Series
EG25-GL_Hardware_Design 19 / 96
4. Pins 37
–40, 118, 127 and 129–139 are used for WLAN & Bluetooth application interfaces, among
which pins 118, 127 and 129
–138 are WLAN function pins, and the rest are Bluetooth function
*
pins.
5. Pins 119
–126 and 128 are used for SGMII interface.
6. Pins 24
–27 of PCM interface can be used not only for audio function on EG25-GL module, but also
for Bluetooth function
*
on FC20 series or FC21 module.
7. Keep all RESERVED pins and unused pins unconnected.
8. GND pin 85
–112 should be connected to ground in the design. RESERVED pin 73–84 should not be
designed in schematic and PCB decal, and these pins should be served as a keepout area.
2.5 Pin Description
The following tables show the pin definition of EG25-GL module. DC characteristics include power
domain and rate current.
Table 4: I/O Parameters Definition
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
OD
Open Drain
PI
Power Input
PO
Power Output
Содержание EG25-GL
Страница 1: ...EG25 GL Hardware Design LTE Standard Module Series Version 1 0 0 Date 2022 09 09 Status Preliminary ...
Страница 8: ...LTE Standard Module Series EG25 GL_Hardware_Design 7 96 9 Appendix References 92 ...
Страница 10: ...LTE Standard Module Series EG25 GL_Hardware_Design 9 96 Table 42 Terms and Abbreviations 92 ...
