2003 Mar 20
21
Philips Semiconductors
Objective specification
2
×
25 W class-D power amplifier
TDA8922
16.11 Bill of materials for reference design
Table 1
Single-chip class-D audio amplifier printed-circuit board (PCB version 4; 1-2002) for TDA8922TH
(see Figs 10 and 11).
BOM ITEM
QUANTITY
REFERENCE
PART
DESCRIPTION
1
1
U1
TDA8922TH
Philips Semiconductors B.V.
2
2
in1 and in2
cinch inputs
Farnell 152-396
3
2
out1 and out2
output connector
Augat 5KEV-02
4
1
V
DD
, GND and V
SS
supply connector
Augat 5KEV-03
5
2
L6 and L5
27
µ
H
EP13 or 16RHBP
6
4
L1, L2, L3 and L4
BEAD
Murata BL01RN1-A62
7
1
S1
PCB switch
Knitter ATE1E M-O-M
8
1
Z1
5V6
BZX 79C5V6 DO-35
9
2
C1 and C2
470
µ
F; 35 V
Panasonic M series
ECA1VM471
10
3
C3, C4 and C5
47
µ
F; 63 V
Panasonic NHG series
ECA1JHG470
11
6
C16, C17, C18, C19, C26 and
C27
470 nF; 63 V
MKT EPCOS B32529-C474-K
12
9
C8, C9, C11, C14, C28, C29,
C32, C35 and C38
220 nF; 63 V
SMD 1206
13
10
C6, C7, C10, C12, C13, C15,
C34, C36, C37 and C39
100 nF; 50 V
SMD 0805
14
2
C20 and C21
330 pF; 50 V
SMD 0805
15
4
C22, C23, C30 and C31
15 nF; 50 V
SMD 0805
16
2
C24, C25
560 pF; 100 V
SMD 0805
17
1
C33
47 pF; 25V
SMD 0805
18
2
R4 and R3
39 k
Ω
; 0.1 W
SMD 0805
19
1
R5
30 k
Ω
; 0.1 W
SMD 1206
20
1
R1
10 k
Ω
; 0.1 W; optional
SMD 0805
21
1
R2
9.1 k
Ω
; 0.1 W; optional
SMD 0805
22
4
R6, R7, R8 and R9
5.6 k
Ω
; 0.1 W
SMD 0805
23
2
R13 and R12
22
Ω
; 1 W
SMD 2512
24
2
R10 and R11
4.7
Ω
; 0.25 W
SMD 1206
25
2
J1 and J2
solder dot jumpers for ground reference in case of hum
(60 Hz noise)
26
2
J3 and J4
wire jumpers for BTL application
27
1
heatsink
30 mm SK400; OK for maximum music dissipation;
1/8 Prated (2
×
75 W/8) in 2
×
4
Ω
at T
amb
= 70
°
C
28
1
printed-circuit board material
1.6 mm thick epoxy FR4 material, double sided 35
µ
m
copper; clearances 300
µ
m; minimum copper track
400
µ
m