2003 Mar 20
2
Philips Semiconductors
Objective specification
2
×
25 W class-D power amplifier
TDA8922
CONTENTS
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
General
8.2
Pulse width modulation frequency
8.3
Protections
8.3.1
Overtemperature
8.3.2
Short-circuit across loudspeaker terminals and
to supply lines
8.3.3
Start-up safety test
8.3.4
Supply voltage alarm
8.4
Differential audio inputs
9
LIMITING VALUES
10
THERMAL CHARACTERISTICS
11
QUALITY SPECIFICATION
12
STATIC CHARACTERISTICS
13
SWITCHING CHARACTERISTICS
14
DYNAMIC AC CHARACTERISTICS (STEREO
AND DUAL SE APPLICATION)
15
DYNAMIC AC CHARACTERISTICS (MONO
BTL APPLICATION)
16
APPLICATION INFORMATION
16.1
BTL application
16.2
Pin MODE
16.3
Output power estimation
16.4
External clock
16.5
Heatsink requirements
16.6
Output current limiting
16.7
Pumping effects
16.8
Reference design
16.9
PCB information for HSOP24 package
16.10
Classification
16.11
Bill of materials for reference design
16.12
Curves measured in reference design
16.13
Application schematics
17
PACKAGE OUTLINE
18
SOLDERING
18.1
Introduction
18.2
Through-hole mount packages
18.2.1
Soldering by dipping or by solder wave
18.2.2
Manual soldering
18.3
Surface mount packages
18.3.1
Reflow soldering
18.3.2
Wave soldering
18.3.3
Manual soldering
18.4
Suitability of IC packages for wave, reflow and
dipping soldering methods
19
DATA SHEET STATUS
20
DEFINITIONS
21
DISCLAIMERS