2000 Oct 17
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
APPLICATION INFORMATION
List of components (See Figs 2 and 3)
Note
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with
ε
r
= 2.2 and thickness = 0.79 mm.
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C2
electrolytic capacitor
10
µ
F; 35 V
−
C3, C4
multilayer ceramic chip capacitor
10 nF; 50 V
−
C5, C6
multilayer ceramic chip capacitor
100 pF; 50 V
−
C7, C8
multilayer ceramic chip capacitor
10 pF; 50 V
−
L1, L2
Grade 4S2 Ferroxcube bead
−
4330 030 36300
R1, R2
metal film resistor
10
Ω
; 0.4 W
2322 195 13109
Z
1
, Z
2
stripline; note 1
50
Ω
−
handbook, full pagewidth
MGM861
C8
C6
R2
L2
Z2
C4
C2
VS2
50
Ω
output
C7
C5
R1
L1
C3
C1
VS1
Z1
50
Ω
input
Fig.2 Test circuit.
Содержание BGY2016
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