Philips BGY1916 Скачать руководство пользователя страница 1 | Manualshive

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DATA SHEET

Product specification
Supersedes data of 1998 May 27

2000 Oct 17

DISCRETE SEMICONDUCTORS

BGY1916
UHF amplifier module

handbook, halfpage

M3D167

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Содержание BGY1916

Страница 1: ...DATA SHEET Product specification Supersedes data of 1998 May 27 2000 Oct 17 DISCRETE SEMICONDUCTORS BGY1916 UHF amplifier module handbook halfpage M3D167 ...

Страница 2: ...th matching and bias circuit components on a metallized ceramic AlN substrate PINNING SOT365A PIN DESCRIPTION 1 RF input 2 VS1 3 VS2 4 RF output Flange ground Fig 1 Simplified outline handbook halfpage MSA447 2 1 3 4 QUICK REFERENCE DATA RF performance at Tmb 25 C LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 60134 MODE OF OPERATION f MHz VS1 V VS2 V PL W Gp dB η ZS ZL ...

Страница 3: ...WR 1 6 1 stability VSWR 2 1 through all phases PL 16 W VS2 25 to 27 V 60 dBc reverse intermodulation Pcarrier 16 W Preverse 40 dBc fi fc 200 kHz 53 dBc B AM bandwidth corner frequency 3 dB Pcarrier 16 W modulation 20 2 MHz ruggedness VSWR 5 1 through all phases no degradation Fig 2 Power gain and efficiency as functions of load power typical values f 1960 MHz VS1 5 V VS2 26 V ZS ZL 50 Ω Tmb 25 C h...

Страница 4: ...ESCRIPTION VALUE CATALOGUE NO C1 C2 electrolytic capacitor 10 µF 35 V C3 C4 multilayer ceramic chip capacitor 10 nF 50 V C5 C6 multilayer ceramic chip capacitor 100 pF 50 V C7 C8 multilayer ceramic chip capacitor 10 pF 50 V L1 L2 Grade 4S2 Ferroxcube bead 4330 030 36300 R1 R2 metal film resistor 10 Ω 0 4 W 2322 195 13109 Z1 Z2 stripline note 1 50 Ω handbook full pagewidth MGM861 C8 C6 R2 L2 Z2 C4 ...

Страница 5: ...miconductors Product specification UHF amplifier module BGY1916 handbook full pagewidth MGM862 90 42 R2 L1 C1 C3 C2 Z1 Z2 C4 C7 C8 C6 C5 R1 L2 VS1 VS2 output input Fig 5 Printed circuit board component layout Dimensions in mm ...

Страница 6: ...between the mounting base and the heatsink to achieve the best possible thermal contact resistance Excessive use of thermal compound will result in an increase in thermal resistance and possible bowing of the mounting base too little will also result in poor thermal conduction The module should be mounted to the heatsink using 3 mm bolts with flat washers The bolts should first be tightened to fin...

Страница 7: ...EC EIAJ mm 4 0 3 8 0 56 0 46 A 9 5 9 0 0 3 0 2 D 30 1 29 9 E 18 6 18 4 12 8 12 6 4 1 3 9 40 74 40 54 2 54 e1 17 78 3 25 3 15 L 6 5 6 1 7 75 7 55 15 4 15 2 48 0 48 4 0 3 0 25 v w 0 1 y DIMENSIONS mm are the original dimensions SOT365A 0 10 20 mm scale Plastic rectangular single ended flat package flange mounted 2 mounting holes 4 in line leads SOT365A p U2 F A U1 U D q E L y Q c v A A w M bp Z 2 3 ...

Страница 8: ... device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips S...

Страница 9: ...2000 Oct 17 9 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES ...

Страница 10: ...2000 Oct 17 10 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES ...

Страница 11: ...2000 Oct 17 11 Philips Semiconductors Product specification UHF amplifier module BGY1916 NOTES ...

Страница 12: ...A MI Tel 39 039 203 6838 Fax 39 039 203 6800 Japan Philips Bldg 13 37 Kohnan 2 chome Minato ku TOKYO 108 8507 Tel 81 3 3740 5130 Fax 81 3 3740 5057 Korea Philips House 260 199 Itaewon dong Yongsan ku SEOUL Tel 82 2 709 1412 Fax 82 2 709 1415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gateway East Suite 200 EL PASO TEXAS 79905 Tel 9 ...

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