6
2 Warning
2.1.
Prevention of Electro Static Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as alumin-
ium foil, to prevent electrostatic charge build up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder remover device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
Содержание VIERA Link SB-ZT2EE
Страница 10: ...10 5 Location of Controls and Components 5 1 Main Unit SU ZT2 ...
Страница 11: ...11 5 2 Speaker Unit SB ZT2 5 3 Remote Control ...
Страница 12: ...12 6 Installation ...
Страница 13: ...13 6 1 Basic Connections 6 1 1 Connecting equipment with HDMI terminal TV DVD recorder etc ...
Страница 14: ...14 6 1 2 Connecting equipment without HDMI terminal DVD player VCR etc ...
Страница 15: ...15 6 1 3 Connecting STB etc and audio terminals DVD player etc ...
Страница 16: ...16 6 1 4 Other connections ...
Страница 17: ...17 6 2 AC power supply connection ...
Страница 18: ...18 7 Speaker setting SB ZT2 7 1 Setting the speakers Front and Surround speakers ...
Страница 19: ...19 ...
Страница 20: ...20 7 2 Setting surround speakers ...
Страница 28: ...28 9 2 2 Speaker Unit SB ZT2 ...
Страница 29: ...29 9 2 3 Speaker Unit SB ZT2 Wireless Link ...
Страница 30: ...30 ...
Страница 32: ...32 ...
Страница 33: ...33 10 1 Main Parts Location Diagram 10 1 1 Main Unit SU ZT2 ...
Страница 34: ...34 10 1 2 Speaker Unit SB ZT2 ...
Страница 36: ...36 10 2 2 Speaker Unit SB ZT2 ...
Страница 49: ...49 Step 4 Remove the Weight ...
Страница 50: ...50 Step 5 Remove 10 screws ...
Страница 54: ...54 Step 11 Remove 2 screws Step 12 Lift up to remove Arm Cover A ...
Страница 56: ...56 Step 14 Tilt the Woofer Block in order as arrows shown to detach it from the Tweeter Block ...
Страница 57: ...57 10 4 2 Disassembly of Middle Cabinet Assembly Refer to Disassembly of Woofer Block Step 1 Remove 7 screws ...
Страница 67: ...67 Step 3 Remove the heatsink with the IC5701 ...
Страница 68: ...68 Step 4 Remove 1 screw Step 5 Remove IC5701 from the heatsink ...
Страница 70: ...70 Step 4 Place the heatsink with the IC5701 onto the SMPS P C B ...
Страница 73: ...73 Step 2 Desolder pins of Diode D5802 on the solder side of SMPS P C B Step 3 Remove the Diode D5802 ...
Страница 82: ...82 Step 4 Remove 3 screws Step 5 Remove the Power Button ...
Страница 87: ...87 Step 3 Remove 4 screws Step 4 Lift up to remove Woofer Speaker SP1 ...
Страница 104: ...104 Caution 3 Ensure that the wires are bound by the himelon at the bottom side of the Tweeter Base Frame ...
Страница 109: ...109 Step 6 Remove the speaker wires from the slot 1 Step 7 Remove the tweeter wires from slots 2 6 ...
Страница 111: ...111 Step 11 Remove 3 screws ...
Страница 112: ...112 Step 12 Remove the Light Panel Step 13 Remove the Power Button ...
Страница 113: ...113 Step 14 Hold on to the P C B Holder and lift up the Input P C B as arrow shown ...
Страница 114: ...114 Step 15 Place the D Amp P C B and Input P C B on an insulation sheet ...
Страница 132: ...132 ...
Страница 133: ...133 14 Overall Simplified Block 14 1 Signal Flow SU ZT2 ...
Страница 144: ...144 ...
Страница 148: ...148 ...
Страница 168: ...168 ...
Страница 176: ...176 ...
Страница 178: ...178 ...
Страница 182: ...182 ...