TH-L32C22T
4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
Содержание TH-L32C22T
Страница 15: ...TH L32C22T 15 7 Disassembly and Assembly Instructions 7 1 AC Cord Dressing DRESSING AC CORD ...
Страница 17: ...TH L32C22T 17 7 3 Speaker Assembly Fixing Fix SPEAKER together RUBBER BUSH to cabinet ...
Страница 19: ...TH L32C22T 19 7 5 Dressing Sp Wire to Cabinet Ribs Sp wire dressing must slot in at location No 1 No 20 ...
Страница 21: ...TH L32C22T 21 7 7 Pedestal Assembly 2 ...
Страница 29: ...TH L32C22T 29 11 Schematic Diagram 11 1 Schematic Diagram Notes ...
Страница 30: ...TH L32C22T 30 11 2 A Board 11 2 1 A Board Sheet 001 1 6 1A 2A 3A 4A ...
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Страница 41: ...TH L32C22T 41 11 2 12 A Board Sheet 003 6 6 1E 2E 3E 4E 5E 3 2v ...
Страница 42: ...TH L32C22T 42 11 3 P Board 11 3 1 P Board 1 3 1A 2A 3A 4A ...
Страница 43: ...TH L32C22T 43 11 3 2 P Board 2 3 1B 2B 3B 4B 5B 1A 2A 3A 4A ...
Страница 44: ...TH L32C22T 44 11 3 3 P Board 3 3 1B 2B 3B 4B 5B 6v 11 9 21v 3 1 3 2 TPC8116 ...
Страница 45: ...TH L32C22T 45 11 4 IP Board TH L32C22TY 11 4 1 IP Board 1 4 1A 2A 3A 4A ...
Страница 46: ...TH L32C22T 46 11 4 2 IP Board 2 4 1B 2B 3B 1A 2A 3A 4A ...
Страница 47: ...TH L32C22T 47 11 4 3 IP Board 3 4 1C 2C 3C 1B 2B 3B ...
Страница 48: ...TH L32C22T 48 11 4 4 IP Board 4 4 1C 2C 3C BD9215AFV ATP201 ...
Страница 71: ...Model No TH L32C22T Parts Location 1 ...
Страница 72: ...Model No TH L32C22TY Parts Location 2 ...
Страница 73: ...Model No TH L32C22T Packing Exploded View 1 ...
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