
10
3.4.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
C (86
F) more than that of the
normal solder.
Definition of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
• (Definition: The letter of
is printed on the P.C.B. using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30 degrees
C (662±86
F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note:
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
The letter of
is printed either foil side or components side on the P.C.B. using the lead free solder.
(See right figure)
Содержание LUMIX DMC-TZ60EB
Страница 24: ...24 7 3 Failure Diagnosis of NFC 7 3 1 Checking flowchart of NFC failure 7 3 2 Initial Setting of NFC...
Страница 27: ...27 9 Disassembly and Assembly Instructions 9 1 Disassembly Flow Chart 9 2 P C B Location...
Страница 29: ...29 9 3 1 Removal of the Rear Case Unit Fig D1 9 3 2 Removal of the Operation P C B Unit Fig D2...
Страница 30: ...30 9 3 3 Removal of the LCD Unit Fig D3 9 3 4 Removal of the Frame Plate Fig D4...
Страница 31: ...31 Fig D5 9 3 5 Removal of the Jack Door Unit PCB Spacer Fig D6...
Страница 32: ...32 9 3 6 Removal of the NFC P C B Fig D7 9 3 7 Removal of the Lens Unit Fig D8...
Страница 33: ...33 9 3 8 Removal of the Main P C B Fig D9 9 3 9 Removal of the Top Case Unit Fig D10...
Страница 34: ...34 9 3 10 Removal of the LVF Unit Top P C B Unit Fig D11 Fig D12...
Страница 52: ...52...