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2020-06-04 | Document No.: AN149
Figure 14: Maximum and recommended solder temperature for soldering the
connector to the PCB in accordance with to JEDEC J-STD-020E
0
50
100
150
200
250
300
t [s]
0
50
100
150
200
250
300
25
T [°C]
up to 120 s
up to 30 s
up to 100 s
Ramp up
3 K/s (max)
Ramp down
6 K/s (max)
245 °C Recommended solder profile
(max 260 °C)
217 °C
240 °C
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Unit
Min
Recommended
Max
Ramp-up rate to preheat
[1]
25 °C to 150 °C
2
3
K/s
Time t
S
T
S
min to T
S
max
t
S
60
100
120
s
Ramp-up rate to peak
[1]
T
Smax
to
T
P
2
3
K/s
Liquidus temperature
T
L
217
°C
Time above liquidus temperature
t
L
80
100
s
Peak temperature
T
P
245
260
°C
Time within 5 °C of the specified
peak temperature T
P
- 5 K
t
P
10
20
30
s
Ramp-down rate
[1]
T
P
to 100 °C
3
6
K/s
Time
25 °C to T
P
480
s
All the temperatures refer to the center of the package, measured on the top of the component
[1]slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
