Orbotech SPTS Xactix e1 Series, Руководство пользователя

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Manual Version e1-4.3.0.ae-R3. Page
4
1 Technical Specifications
1. The system provides pulsed delivery of xenon difluoride gas, using a single expansion chamber, to
a reaction chamber capable of holding a wide variety of samples up to a 6” wafer.
2. Physical Characteristics:
a. A table top unit to minimize use of expensive lab space (620mm wide X 780mm deep X
770mm high, plus computer, monitor, keyboard and pump control box).
b. Chamber optimized to hold parts up to 6” wafers.
c. Dry vacuum pump proven to hold up to XeF
2
. This is important; not all pumps stand up well
to XeF
2
. SPTS has spent a lot of time and resources finding a pump that will operate
reliably.
3. Sound Pressure Level: Less than 52dB(A). Sole source of sound is the pump.
4. Control: The system is computer controlled with a graphical user interface and provides the
following capabilities.
a. Multi-user software interface with password protected access for each user.
b. Password protected access to maintenance software.
c. Recipe storage.
d. Process parameters logged for each etch.
e. Set Cycle Time, Number of Cycles, XeF
2
Pressure from software user interface
f. Mix XeF
2
with Nitrogen. Set pressure for nitrogen from software user interface.
g. Define pause time between cycles from software user interface.
h. Plots process chamber pressure on GUI and records pressures in log file.
i.
Interactive GUI for recipe definition, storage and editing.
j. Interactive GUI for configuring system operating variables
k. Automated pressure gauge recalibration. Can be run either interactively through the GUI or
scheduled to run automatically on a user defined frequency.
l. Leak back test utility for expansion chamber and process chamber
m. Automated system characterization to minimize over shoot and undershoot of XeF
2
pressure in expansion chamber.
n. During etch process chamber pressure is sampled at regular intervals, plotted in the GUI
and stored for later review.
5. Inspection: The system provides the ability to view entire surface of sample (up to 6” wafer) while it
is being etched through a transparent process chamber lid and shower head.
6. Safety: The system provides the following features:
a. Built in, retractable fume hood with hardware interlock which automatically prevents venting
process chamber to atmosphere when fume hood is retracted.
b. Duplicate emergency power off (EPO) button for positioning with pump in chase.
c. Pump turned off with EPO and power switch on unit.
d. Hardware interlock automatically shuts off all valves with loss of vacuum.
e. Hardware interlock automatically closes XeF
2
source when process chamber is near
atmosphere
f. Exhausted gas box with inlet for purge gas.
g. Built in leak check after changing XeF
2
source bottles
h. Automated nitrogen purge of connections to XeF
2
source bottles before and after changing
XeF
2
source bottles.
i. Software guided XeF
2
source bottle change procedure.
j. Software controlled process chamber load/unload nitrogen purge.
k. Internal regulators limit CDA and N
2
pressure to avoid unsafe failure from over pressure.
7. Other key features:
a. Modular gas panel to allow easy replacement of gas components.
b. DeviceNet communications protocol for control components.
c. CD drive allows writing CDs for transferring etching log data and picture from camera
option.
8. Available Options: The following options are available at either time of sale or for later upgrade of
the system.
a. Touch screen interface. (Available with purchase of the Touch Screen Option).
b. Binocular microscope and stand for viewing samples in the chamber while etching.
(Available with purchase of the Microscope Option).