ODU MINI-SNAP K Series, Руководство пользователя

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104
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
4 K C – P – 0
Clearance and creepage
distance
Test
voltage
2
kVe ff
Nominal
voltage
5
kVrms
Termi-
nation
diameter
mm
Termination
cross-section
View on
termination area
Contact to
contact
mm
Contact to
housing
mm AWG mm
2
Pin piece Socket piece
1.5 1 1.350 0.450 2.40 12 2.50
2.1 1.6 1.650 0.550
1.85 14 1.5
0.7 – –
0.8 1 1.575 0.520
0.85 22 0.38
0.5 – –
0.6 0.8 0.900 0.300 0.85 22 0.38
0.8 1 1.000 0.333
0.6 26 0.15
0.5 – –
Number
of
contacts
0 7
5
3 0
4 0
Contact type
Te
rm
in
at
ion
Soc
ket
Pin
Solder
L M
PCB 3 R
Solder
L M
PCB 3
R
Solder
L M
PCB 3 R
Part number
key
T S 9
T Q 9
T 0 9
J G O
J O O
F G 0
F D 0
F O 0
1 Derating factor, see page 167.
2 SAE AS 13441:2004 method
3001.1.
3 PCB layouts, see page 105.
4 Max. operating voltage at NN (sea
level) acc. to SAE AS 13441:2004
method 3001.1.
Further information on page 168.
5 Not compatible to competition.
CONTACT INSERTS (SIZE 4)
Size (4)
Q
Q
Q
Contact
diameter
mm
Single
contact
nominal
current
1
A
2
24
18
0.9 7.5
0.7
7.5
6
SERIES K – INSERTS
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