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TDA8932B_3

Product data sheet

Rev. 03— 21 June 2007

45 of 48

NXP Semiconductors

TDA8932B

Class-D audio amplifier

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

18. Abbreviations

MSL: Moisture Sensitivity Level

Fig 42. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 18.

Abbreviations

Acronym

Description

BTL

Bridge Tied Load

DMOS

Double diffused Metal Oxide Semiconductor

ESD

ElectroStatic Discharge

OCP

OverCurrent Protection

OTP

OverTemperature Protection

OVP

OverVoltage Protection

PWM

Pulse Width Modulation

Single-Ended

Thermal Foldback

UBP

UnBalance Protection

UVP

UnderVoltage Protection

Window Protection

Содержание TDA8932B

Страница 1: ...nfiguration BTL or as stereo half bridge configuration SE 2 Features n Operating voltage from 10 V to 36 V asymmetrical or 5 V to 18 V symmetrical n Mono bridged tied load full bridge or stereo single...

Страница 2: ...rent Operating mode no load no snubbers and no filter connected 40 50 mA Stereo SE channel Rs 0 1 1 Po RMS RMS output power continuous time output power per channel THD N 10 fi 1 kHz RL 4 VP 22 V 13 8...

Страница 3: ...OUT1 VSSP1 PWM MODULATOR DRIVER HIGH DRIVER LOW CTRL MANAGER CTRL PWM MODULATOR PROTECTIONS OVP OCP OTP UVP TF WP STABILIZER 11 V STABILIZER 11 V REGULATOR 5 V MODE VDDA 15 14 IN1P OSCREF OSCIO VDDA...

Страница 4: ...1 30 29 28 27 Table 3 Pin description Symbol Pin Description VSSD HW 1 negative digital supply voltage and handle wafer connection IN1P 2 positive audio input for channel 1 IN1N 3 negative audio input...

Страница 5: ...e Ended SE The TDA8932B contains common circuits to both channels such as the oscillator all reference sources the mode functionality and a digital timing manager The following protections are built i...

Страница 6: ...rical supply conditions the voltage applied to pins POWERUP and ENGAGE must never exceed the supply voltage VDDA VDDP1 or VDDP2 If the transition between Mute mode and Operating mode is controlled via...

Страница 7: ...re used in the same audio application it is recommended to synchronize the switching frequency of all devices This can be realized by connecting all pins OSCIO together and configure one of the TDA893...

Страница 8: ...ncluded in the TDA8932B Thermal Foldback TF OverTemperature Protection OTP OverCurrent Protection OCP Window Protection WP Supply voltage protection UnderVoltage Protection UVP OverVoltage Protection...

Страница 9: ...limiting The amplifier can distinguish between an impedance drop of the loudspeaker and a low ohmic short circuit across the load or to one of the supply lines This impedance threshold depends on the...

Страница 10: ...conditions should be distinguished 1 If the supply voltage is pumped to higher values by the TDA8932B application itself see also Section 14 3 the OVP is triggered and the TDA8932B is shut down The s...

Страница 11: ...the phase of one of the two channels can be inverted so that the amplifier can operate as a mono BTL amplifier The input configuration for a mono BTL application is illustrated in Figure 7 In SE conf...

Страница 12: ...EF This output voltage reference buffer charges the capacitor on pin HVPREF Pin INREF This output voltage reference buffer charges the input reference capacitor on pin INREF Pin INREF applies the bias...

Страница 13: ...13 of 48 NXP Semiconductors TDA8932B Class D audio amplifier 5 ENGAGE 6 POWERUP 7 CGND 8 VDDA Table 7 Internal circuitry Continued Pin Symbol Equivalent circuit 001aaf608 100 k 20 2 k 20 Iref 50 A 2 8...

Страница 14: ...14 of 48 NXP Semiconductors TDA8932B Class D audio amplifier 9 VSSA 10 OSCREF 11 HVPREF 13 TEST 18 DREF Table 7 Internal circuitry Continued Pin Symbol Equivalent circuit 001aad791 9 VSSD VDDA 001aad...

Страница 15: ...19 HVP2 30 HVP1 20 VDDP2 23 VSSP2 26 VSSP1 29 VDDP1 21 BOOT2 28 BOOT1 22 OUT2 27 OUT1 24 STAB2 25 STAB1 31 OSCIO Table 7 Internal circuitry Continued Pin Symbol Equivalent circuit 001aag026 19 30 VSS...

Страница 16: ...nditions Min Max Unit VP supply voltage asymmetrical supply 1 0 3 40 V Vx voltage on pin x IN1P IN1N IN2P IN2N 2 5 5 V OSCREF OSCIO TEST 3 VSSD HW 0 3 5 V POWERUP ENGAGE DIAG 4 VCGND 0 3 6 V all other...

Страница 17: ...ter from junction to top 3 2 K W Rth j c thermal resistance from junction to case free air natural convection 4 0 K W Table 9 Thermal characteristics Continued Symbol Parameter Conditions Min Typ Max...

Страница 18: ...outputs pins OUT1 and OUT2 VO offset output offset voltage SE with respect to pin HVPREF Mute mode 15 mV Operating mode 100 mV BTL Mute mode 20 mV Operating mode 150 mV Stabilizer output pins STAB1 a...

Страница 19: ...C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Internal oscillator fosc oscillator frequency Rosc 39 k 320 kHz range 300 500 kHz Timing PWM output pins OUT1 and OUT2 tr ris...

Страница 20: ...L 4 VP 22 V THD N 0 5 fi 1 kHz 10 9 12 1 W THD N 0 5 fi 100 Hz 12 1 W THD N 10 fi 1 kHz 13 8 15 3 W THD N 10 fi 100 Hz 15 3 W RL 8 VP 30 V THD N 0 5 fi 1 kHz 11 1 12 3 W THD N 0 5 fi 100 Hz 12 3 W THD...

Страница 21: ...0 100 V VO mute mute output voltage Mute mode Vi 1 V RMS and fi 1 kHz 100 V CMRR common mode rejection ratio Vi cm 1 V RMS 75 dB po output power efficiency Po 15 W VP 12 V and RL 4 88 90 Po 30 W VP 22...

Страница 22: ...on resistance power switch Rs series resistance output inductor RESR equivalent series resistance SE capacitor tw min minimum pulse width s 80 ns typical fosc oscillator frequency Hz 320 kHz typical...

Страница 23: ...b THD N 10 Fig 8 SE output power as a function of supply voltage VP V 10 40 30 20 20 10 30 40 Po W 0 RL 4 6 8 001aad768 VP V 10 40 30 20 20 10 30 40 Po W 0 RL 4 6 8 001aad769 a THD N 0 5 b THD N 10 F...

Страница 24: ...ance SE capacitor Example A 4 speaker in the BTL configuration can be used up to a supply voltage of 18 V without running into current limiting Current limiting clipping will avoid audio holes but it...

Страница 25: ...t 30 dB for SE or 36 dB for BTL The gain can be reduced by a resistive voltage divider at the input see Figure 10 When applying a resistive divider the total closed loop gain Gv tot can be calculated...

Страница 26: ...SCREF and VSSD HW setting the carrier frequency Pin OSCIO of the master is then configured as an oscillator output for synchronization The OSCREF pins of the slave devices should be shorted to VSSD HW...

Страница 27: ...rom junction to ambient Tj max maximum junction temperature Tamb ambient temperature P power dissipation which is determined by the efficiency of the TDA8932B The power dissipation is shown in Figure...

Страница 28: ...All rights reserved Product data sheet Rev 03 21 June 2007 28 of 48 NXP Semiconductors TDA8932B Class D audio amplifier Fig 12 SE application for reducing pumping effects 001aad763 IN1P OUT1 audio in...

Страница 29: ...c distortion plus noise as a function of output power per channel 001aad772 10 1 10 2 10 1 102 THD N 10 3 Po W channel 10 2 102 10 10 1 1 1 2 3 001aad773 10 1 10 2 10 1 102 THD N 10 3 Po W channel 10...

Страница 30: ...upply voltage ripple rejection as a function of frequency 001aad776 20 30 40 Gv dB 10 fi Hz 10 105 104 102 103 1 2 001aad777 60 40 80 20 0 SVRR dB 100 fi Hz 10 105 104 102 103 1 2 Ri 0 20 kHz brick wa...

Страница 31: ...8 Fig 19 Output power per channel as a function of supply voltage Fig 20 Power dissipation as a function of supply voltage VP V 10 38 30 34 14 18 22 26 001aaf886 16 8 24 32 Po W channel 0 4 1 2 3 VP V...

Страница 32: ...V 2 VP 34 V Fig 23 Output power per channel as a function of time t s 0 600 480 240 360 120 001aaf887 16 8 24 32 0 Po W channel 2 1 3 t s 0 600 480 240 360 120 001aaf888 16 8 24 32 0 Po W channel 2 1...

Страница 33: ...6 Total harmonic distortion plus noise as a function of output power 001aad782 10 1 10 2 10 1 102 THD N 10 3 Po W 10 2 102 10 10 1 1 1 2 3 001aad783 10 1 10 2 10 1 102 THD N 10 3 Po W 10 2 102 10 10 1...

Страница 34: ...ency 001aae116 20 30 40 Gv dB 10 fi Hz 10 105 104 102 103 1 2 001aae117 60 40 80 20 0 SVRR dB 100 fi Hz 10 105 104 102 103 1 2 Ri 0 20 kHz brick wall filter AES17 1 RL 4 VP 12 V 2 RL 8 VP 22 V fi 1 kH...

Страница 35: ...22 V 2 VP 26 V 3 VP 29 V Fig 32 Output power as a function of time t s 0 600 480 240 360 120 001aaf896 16 8 24 32 0 Po W 2 1 3 t s 0 600 480 240 360 120 001aaf899 20 40 60 10 30 50 Po W 0 2 1 3 fi 1...

Страница 36: ...miconductors TDA8932B Class D audio amplifier fi 1 kHz power dissipation in junction only short time Po at THD N 10 dashed line will require heat sink for continuous time output power 1 RL 4 2 RL 8 Fi...

Страница 37: ...70 pF Rsn 10 Rsn 10 Llc Llc VSSD HW IN1P Cbo 15 nF Cbo 15 nF Cdref 100 nF Chvp 100 nF Cinref 100 nF Chvp 100 nF Chvpref 47 F 25 V Cvddp 220 F 35 V Cse Cse 470 nF Cin 470 nF Cin 470 nF Cin 100 nF Cosc...

Страница 38: ...lc Llc VSSD HW IN1P Cdref 100 nF Chvp 100 nF Cinref 100 nF Chvp 100 nF 1 F Cin 100 nF Cosc 39 k Rosc MUTE control VPA SLEEP control OSCIO IN1N HVP1 DIAG VDDP1 ENGAGE BOOT1 VP VP POWERUP OUT1 CGND VSSP...

Страница 39: ...25 V 470 nF Cin 470 nF Cin 470 nF Cin 100 nF Cosc 39 k Rosc 10 Rvdda MUTE control VDDA VSSA VSS VSSA VSSA VSSA VSSA SLEEP control Cvdda 100 nF VDD VDDA 10 Rvssa VSS VSSA VDD VSS Cvssa 100 nF Cvssp 22...

Страница 40: ...Rsn 10 Llc Llc VSSD HW IN1P Cdref 100 nF Cinref 100 nF 100 nF Cosc 39 k Rosc MUTE control VDDA VSSA VSSA VSSA VSSA SLEEP control OSCIO IN1N HVP1 DIAG VDDP1 ENGAGE BOOT1 VDD VSSA VSSA POWERUP OUT1 CGN...

Страница 41: ...36 0 27 0 18 20 7 20 3 7 6 7 4 1 27 10 65 10 00 1 2 1 0 0 95 0 55 8 0 o o 0 25 0 1 0 004 0 25 DIMENSIONS inch dimensions are derived from the original mm dimensions Note 1 Plastic or metal protrusions...

Страница 42: ...es 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included 2 Plastic interlead protrusions of 0 25 mm maximum per side are not included SOT549 1 03 04 07 05 11 02 w M A A1 A2 Eh Dh...

Страница 43: ...he wave soldering process is suitable for the following Through hole components Leaded or leadless SMDs which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered Pa...

Страница 44: ...It is imperative that the peak temperature is high enough for the solder to make reliable solder joints a solder paste characteristic In addition the peak temperature must be low enough that the pack...

Страница 45: ...ofiles for large and small components 001aac844 temperature time minimum peak temperature minimum soldering temperature maximum peak temperature MSL limit damage level peak temperature Table 18 Abbrev...

Страница 46: ...ss D audio amplifier 19 Revision history Table 19 Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8932B_3 20070621 Product data sheet TDA8932B_2 Modifications S...

Страница 47: ...or in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconduct...

Страница 48: ...tage protection 10 8 5 Diagnostic input and output 11 8 6 Differential inputs 11 8 7 Output voltage buffers 11 9 Internal circuitry 12 10 Limiting values 16 11 Thermal characteristics 16 12 Static cha...

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