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32.4.4.1.4.4 Fields
Field
Function
7-6
KEYEN
Backdoor Key Security Enable
These bits enable and disable backdoor key access to the FTFC module.
00b - Backdoor key access disabled
01b - Backdoor key access disabled (preferred KEYEN state to disable backdoor key access)
10b - Backdoor key access enabled
11b - Backdoor key access disabled
5-4
MEEN
Mass Erase Enable Bits
Enables and disables mass erase capability of the FTFC module. When the SEC field is set to unsecure,
the MEEN setting does not matter.
00b - Mass erase is enabled
01b - Mass erase is enabled
10b - Mass erase is disabled
11b - Mass erase is enabled
3-2
FSLACC
Factory Failure Analysis Access Code
These bits enable or disable access to the flash memory contents during returned part failure analysis at
the factory. When SEC is secure and FSLACC is denied, access to the program flash contents is denied
and any failure analysis performed during factory test must begin with a full erase to unsecure the part.
When access is granted (SEC is unsecure, or SEC is secure and FSLACC is granted), factory testing has
visibility of the current flash contents. The state of the FSLACC bits is only relevant when the SEC bits
are set to secure. When the SEC field is set to unsecure, the FSLACC setting does not matter.
00b - Factory access granted
01b - Factory access denied
10b - Factory access denied
11b - Factory access granted
1-0
SEC
Flash Security
These bits define the security state of the MCU. In the secure state, the MCU limits access to FTFC
module resources. The limitations are defined per device and are detailed in the Chip Configuration
details. If the FTFC module is unsecured using backdoor key access, the SEC bits are forced to 10b.
00b - MCU security status is secure
01b - MCU security status is secure
10b - MCU security status is unsecure (The standard shipping condition of the FTFC is unsecure.)
11b - MCU security status is secure
32.4.4.1.5 Flash Option Register (FOPT)
32.4.4.1.5.1 Offset
Register
Offset
FOPT
3h
Memory map and registers
MWCT101xS Series Reference Manual, Rev. 3, 07/2019
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NXP Semiconductors
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