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UM10237_2
© NXP B.V. 2008. All rights reserved.
User manual
Rev. 02 — 19 December 2008
7 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Table 6.
LPC2420/60 ordering options
Type number
Flash
(kB)
SRAM (kB)
External
bus
Ethernet
USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
C
AN cha
n
nels
SD/
MMC
GP
DMA
A
DC cha
n
nels
D
AC cha
n
nels
Temp
range
Loc
a
l bu
s
Ethernet buffer
GP/USB
RT
C
To
ta
l
LPC2420FBD208
N/A
64 -
16 2
82 Full 32-bit
-
yes
-
yes
yes
8
1
−
40
°
C to
+85
°
C
LPC2460FBD208
N/A
64 16 16 2
98 Full 32-bit
MII/RMII
yes
2
yes
yes
8
1
−
40
°
C to
+85
°
C
LPC2460FET208
N/A
64 16 16 2
98 Full 32-bit
MII/RMII
yes
2
yes
yes
8
1
−
40
°
C to
+85
°
C
Table 7.
LPC2468 ordering information
Type number
Package
Name
Description
Version
LPC2468FBD208 LQFP208
plastic low profile quad flat package; 208 leads; body 28
×
28
×
1.4 mm
SOT459-1
LPC2468FET208
TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Table 8.
LPC2468 ordering options
Type number
Flash
(kB)
SRAM (kB)
External
bus
Ethernet
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
CA
N c
h
annels
SD/
MMC
GP
DMA
AD
C c
h
annels
DA
C c
h
annels
Temp
range
Lo
ca
l bu
s
Ethe
rne
t buf
fer
GP/
U
S
B
RTC
To
ta
l
LPC2468FBD208
512
64 16 16 2
98 Full 32-bit
MII/
RMII
yes
2 yes
yes
8
1
−
40
°
C to
+85
°
C
LPC2468FET208
512
64 16 16 2
98 Full 32-bit
MII/
RMII
yes
2 yes
yes
8
1
−
40
°
C to
+85
°
C
Table 9.
LPC2470 ordering information
Type number
Package
Name
Description
Version
LPC2470FBD208 LQFP208
plastic low profile quad flat package; 208 leads; body 28
×
28
×
1.4 mm
SOT459-1
LPC2470FET208
TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15
×
15
×
0.7 mm
SOT950-1