NXP Semiconductors
UM11636
KITPF5200SKTEVM evaluation board
Schematic label
Signal name
Description
J9-1-2
V1P5D
TBBEN is supplied with V1P5D (TBB mode forced)
J9-3-4
TBBEN_MCU
TBBEN pin is controlled by the MCU in Normal or
TBB mode
J9-5-6
GND
TBBEN is tied to Ground (Normal mode forced)
Table 6. TBBEN_SEL jumper (J9)
4.3.5 VIN_IC jumper (J10)
This jumper selects the VIN power source. The main purpose is to enable VIN current
measurements.
Schematic label
Signal name
Description
J10-1
VIN
Connected to VIN power input power supply
J10-2
VIN_IC
Connected to VIN of the device
Table 7. VIN_IC jumper (J10)
4.3.6 PWRON_SEL jumper (J12)
PWRON can be controlled either by the FRDM-KL25Z MCU, allowing control by script, or
manually.
Schematic label
Signal name
Description
J12-1-2
PWRON_MCU
PWRON pin is controlled by the MCU
J12-2-3
PWRON_SW
PWRON pin is controlled manually by SW1
Table 8. PWRON_SEL jumper (J12)
4.3.7 VDDIO_EN jumper (J14)
VDDIO_EN enables VDDIO from the external LDO to the VDDIO pin of the device.
Schematic label
Signal name
Description
J14-1
VDDIO ext
VDDIO voltage from external LDO
J14-2
VDDIO PF5200
VDDIO connected to PF5200
Table 9. VDDIO_EN jumper (J14)
4.3.8 VDDIO_SEL jumper (J16)
VDDIO_SEL selects 1.8 V or 3.3 V for VDDIO.
Schematic label
Signal name
Description
J16-1-2
VDDIO 3.3 V
Set external LDO to 3.3 V
J16-2-3
VDDIO 1.8 V
Set external LDO to 1.8 V
Table 10. VDDIO_SEL jumper (J16)
4.3.9 PGOOD_SEL jumper (J22)
PGOOD_SEL selects either PGOOD/GPO or temperature sensor.
To be effective, the PGOOD pin must be configured correctly through I
2
C using the GUI.
UM11636
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© NXP B.V. 2021. All rights reserved.
User manual
Rev. 2 — 13 December 2021
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