DA70131-1/3E
VI-3
3-2. Precautions about G9002
1) In order to prevent damage caused by static electricity, pay attention to the following.
- Make sure to ground all equipment, tools, and jigs that are present at the work site.
- Ground the work desk surface using a conductive mat or similar apparatus (with an appropriate resistance
factor). However, do not allow work on a metal surface, which can cause a rapid change in the electrical
charge on the LSI (if the charged LSI touches the surface directly) due to extremely low resistance.
- When picking up an LSI using a vacuum device, provide anti-static protection using a conductive rubber pick
up tip. Anything which contacts the leads should have as high a resistance as possible.
- When using a pincer that may make contact with the LSI terminals, use an anti-static model. Do not use a
metal pincer, if possible.
- Store unused LSIs in a PC board storage box that is protected against static electricity, and make sure there
is adequate clearance between the LSIs. Never directly stack them on each other, as it may cause friction
that can develop an electrical charge.
2) Operators must wear wrist straps which are grounded through approximately 1M-ohm of resistance.
3) Use low voltage soldering devices and make sure the tips are grounded.
4) Do not store or use LSIs, or a container filled with LSIs, near high-voltage electrical fields, such those
produced by a CRT.
5) To preheat LSIs for soldering, we recommend keeping them at a high temperature in a completely dry
environment, i.e. 125
o
C for 24 hours. The LSI must not be exposed to heat more than 2 times.
6) When using an infrared reflow system to apply solder, we recommend the use of a far-infrared pre-heater and
mid-infrared reflow devices, in order to ease the thermal stress on the LSIs.
Package and substrate surface temperatures must never exceed 260
o
C and 230
o
C for 30 to 50 seconds.
(7) When using hot air for solder reflow, the restrictions are the same as for infrared reflow equipment.
(8) If you will use a soldering iron, the temperature at the leads must not be 260
o
C or less for more than 10
seconds, and must not be 350
o
C or less for more than 3 seconds.
Product flow direction
Far-infrared heater (pre-heater)
Mid-infrared heater (reflow-heater)
Time
260
230
Temperature
o
C
190
180
60 to 120 seconds
35 to 50 seconds
[Recommended temperature profile of a far-infrared heater, hot air reflow]
Содержание Motionnet G9001A
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